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Introduction

IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you'll join a team who invent what's next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make.

IBM's product and technology landscape includes Research, Software, and Infrastructure. Entering this domain positions you at the heart of IBM, where growth and innovation thrive.

Your role and responsibilities

IBM Research at Albany, NY is seeking experienced engineer who will push boundaries in the development of cutting-edge patterning methodologies and plasma etch processes for next generation semiconductor technologies. In this role, you will be responsible for defining patterning strategies from initial concept of film stacks and process flow through the development of plasma etch processes and its maturing as process of record to meet advanced logic ground rule targets.

The hired candidates would be a demonstrated technical and industry leader in semiconductor plasma etch with fundamental and deep understanding of plasma physics, etch chemistries, and plasma etch equipment system. The candidate will be a hands-on engineering leader with significant expertise in BEOL patterning processes such as trench/via multi-patterning, dielectric etch. The candidate should also demonstrate strong understanding of industry trends and roadmap in the BEOL interconnect area. The position also involves mentoring junior engineers and close collaboration with multi company and cross function engineers from materials, unit process, equipment, integration, layout design, and modeling. Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected. Strong analytical and design-of-experiment experience, and excellent written and verbal communication skills in English are required.

Required technical and professional expertise

* Master’s degree in a science or engineering discipline

* 5+ years hands-on industry experience in plasma etch process or plasma etch equipment development

* 5+ hands-on experience in a semiconductor research and development environment

* 5+ years hands-on experience with interpreting failure analysis from structural and chemical characterization techniques.

* Design of experiments, process controls, and statistical data analysis

Preferred technical and professional experience

* PhD degree in a science or engineering discipline

* 10+ years hands-on industry experience in plasma etch process or plasma etch equipment development

* 10+ years hands-on industry experience in BEOL etch process development

* 10+ years hands-on industry experience in a semiconductor research and development environment

IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.