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Introduction

At IBM Research, we invent things that matter to the world. Today, we are pioneering the most promising and disruptive technologies that will transform industries and society, including the future of AI, Blockchain and Quantum Computing. We are driven to discover. With more than 3,000 researchers in 12 labs located across six continents, IBM Research is one of the world’s largest and most influential corporate research labs.

Your role and responsibilities

IBM Research at Albany, NY is seeking engineers who will push boundaries in the development of cutting-edge patterning methodologies, plasma etch processes, and plasma etch infrastructures for next generation semiconductor technologies. Some of the responsibilities includes defining patterning strategies from initial concept of film stacks and process flow through the development of plasma etch processes and its maturing as process of record to meet advanced logic ground rule targets, as well as driving control, improvement, and troubleshooting of plasma etch equipment.

The hired candidates would be a demonstrated technical proficiency in semiconductor plasma etch with fundamental and deep understanding of plasma physics, etch chemistries, and plasma etch equipment system. The candidate will be a hands-on engineering leader with significant expertise in FEOL/MOL/BEOL patterning processes such as conductor and dielectric etches. The position also involves close collaboration with multi company and cross function engineers from materials, unit process, equipment, integration, layout design, and modeling. Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected. Strong analytical and design-of-experiment experience, and excellent written and verbal communication skills in English are required.

Required technical and professional expertise

* Bachelor’s degree in a science or engineering discipline

* 4+ years hands-on industry experience in plasma etch process or plasma etch equipment development

* 4+ hands-on experience in a semiconductor research and development environment

* 4+ years hands-on experience with interpreting failure analysis from structural and chemical characterization techniques.

* Design of experiments, process controls, and statistical data analysis

Preferred technical and professional experience

* Master/PhD degree in a science or engineering discipline

* 6+ years hands-on industry experience in plasma etch process or plasma etch equipment development

* 6+ years hands-on industry experience in plasma etch process developmenth

* 6+ years hands-on industry experience in a semiconductor research and development environment

IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.