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  • Flex Interconnect Signal Integrity Engineer

    IBM (Rochester, MN)



    Apply Now

    Introduction

     

    IBM Infrastructure has an opening for an experienced Flexible Interconnect Signal Integrity Engineer. As a member of this elite team of engineering professionals, you will develop solutions through high-speed serial channel analysis for flexible printed circuit board development that enable hardware in Quantum systems. Team members of this department impact IBM’s diverse product portfolio through involvement in high-level design support, pre-production analysis, and lab validation and model-to-hardware correlation of early user hardware.

     

    Qualified candidates will have excellent interpersonal, communications, critical thinking, and problem-solving skills paired with knowledge of Flex/PCB material properties. Additional skills include experience with signal and power integrity software such as ANSYS and Cadence tools suites and PCB design software. A strong background in electrical engineering, transmission line theory, digital signal processing, radio frequency design, and packaging and Flex/PCB materials/processes is helpful.

     

    Your role and responsibilities

     

    Perform strategic analysis on pre-production flex designs utilizing commercially available and internally developed electromagnetic modelling tool suites, scripting, and transient simulation methodologies to validate and improve the performance of innovative high-performance high-quality future designs supporting IBM business goals focused on the Quantum brand.

     

    • Execute laboratory verification/characterization on flex designs utilizing a VNA and TDR, enabling model-to-hardware correlation to add value to future designs.

    • Collaborate with cross-site/cross-geo teams and external vendors to establish and refine strategy for tackling aggressive product goals and schedules.

    • Continuously innovating design and development processes with the department and utilizing Agile best practices.

    Required technical and professional expertise

    • 3-5 years of industry work experience in Signal and Power Integrity, Flex Design, or Hardware Development environment

    • Demonstrated experience in technical execution

    • Demonstrated excellence in communication skills

    • Eagerness to learn, demonstrating a growth mindset

    • Ability to proactively solve problems independently and in a team environment

    Preferred technical and professional experience

    • Comprehensive understanding of Signal and Power Integrity, Flex/PCB material properties, transmission line theory, and hardware development engineering processes

    • Experience with one or more programming skills such as Python, Skill, Perl, C++, Matlab

    • Comprehensive skills with signal and power integrity simulation software tools

    • Demonstrated ability to develop peer, cross-functional, and-cross business relationships to maximize collaboration and team effectiveness

    • Demonstrated ability to work and excel in a fast-paced, dynamic, and constantly changing work environment

     

    IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.

     


    Apply Now



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