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RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE TYPE: Polygraph

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The Northrop Grumman Mission Systems (NGMS) Microelectronics and Device Applications (MDA) group pushes the boundaries of innovation, redefines the leading edge of exotic new technologies, and drives advances in the sciences. One of our most challenging new fields is Transformational Computing, which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. Our team is chartered with providing the skills to transform computing beyond Moore’s Law, advancing development of computer architectures, processing/memory subsystems, and large-scale high-performance computing systems. You’ll work in an R&D environment alongside a broad array of scientists and engineers to make these processing solutions a reality and deliver remarkable new advantages to the warfighter.

**Northrop Grumman Microelectronics Center (NGMC)**  is a leader in advanced development of semiconductor system solutions for the military, aerospace, and commercial markets.  For more than 50 years, we have been offering a wide range of trusted foundry and semiconductor services that deliver high performing and reliable microelectronics. Our wide breadth of technologies and capabilities includes research in advanced computing solutions to provide our customers with unique “More than Moore” solutions.

Microelectronics | Northrop Grumman (https://www.northropgrumman.com/what-we-do/microelectronics)

**The Northrop Grumman Microelectronics Design & Applications (MDA)**  business area is leading efforts to transform computing, combining the unique properties of superconductivity and quantum mechanics to develop revolutionary energy-efficient computing systems. You will work in a fast-paced team environment alongside a broad array of engineers to make these next generation processing solutions a reality.

\#NGMC

_This position requires 100% fulltime work onsite at either our Advanced Technologies Laboratory located in Linthicum, MD or in Annapolis Junction, MD_

Candidate will work as a thermal scientist supporting the development of superconducting computing technologies. Responsibilities include creating low temperature numerical models, running experiments measuring material thermal properties, boundary resistances, and heating in components. The job will often require deep dives into literature to understand the unique physics that occurs in the sub-Kelvin/nanoscale regime.

_This position can be filled at the Principal Thermal Scientist level OR Senior Principal Thermal Scientist level. Qualifications for both are listed below:_

Basic Qualifications for a Principal Thermal Scientist:

+ Bachelor’s degree in Science, Technology, Engineering, or Mathematics (STEM) with 5 years of relevant experience; Master's degree in STEM related field with 3 years' of relevant technical experience **OR** Masters’ degree in STEM related field and currently enrolled in a PhD program with a completion date prior to start with 1 year of relevant technical experience **OR** PhD in STEM related field with 1 year of relevant technical experience.

+ 3 years of heat transfer analysis experience with at least 2 years in cryogenic analysis and design. Can be substituted with relevant thesis work exceeding 2 years.

+ Working knowledge of thermal analysis software (COMSOL, IcePak, Sinda/Fluint) or similar.

+ Experience with and proficiency in:

+ Problem solving and analytical skills

+ Heat transfer and thermodynamics

+ Experimental design

+ Ability to communicate effectively to team members both verbally and in writing.

+ Ability to adjust to changing priorities and requirements.

+ Eligibility to obtain and maintain a TS/SCI with polygraph security clearance. US citizenship is a prerequisite.

+ Active TS/SCI with polygraph security clearance

Basic Qualifications for a Senior Principal Thermal Scientist:

+ Bachelor's of Science in: Mechanical Engineering, Aerospace Engineering, Structural Engineering, Physics or related field specializing in thermodynamics and heat transfer with 8 years of experience, a M.S Degree with 6 years of experience, or a PhD with 4 years of experience

+ 3 years of heat transfer analysis experience with at least 2 years in cryogenic analysis and design. Can be substituted with relevant thesis work exceeding 2 years.

+ Working knowledge of thermal analysis software (COMSOL, IcePak, Sinda/Fluint) or similar.

+ Experience with and proficiency in:

+ Problem solving and analytical skills

+ Heat transfer and thermodynamics

+ Experimental design

+ Ability to communicate effectively to team members both verbally and in writing.

+ Ability to adjust to changing priorities and requirements.

+ Working knowledge of cryogenic test systems; dilution refrigeration, 4 K cryo-coolers, Adiabatic Demagnetization Refrigeration (ADR) and liquid helium immersion.

+ Experience in cryogenic system design and analysis

+ Experience in nanoscale heat transfer

+ Eligibility to obtain and maintain a TS/SCI with polygraph security clearance. US citizenship is a prerequisite.

Preferred Qualifications for both Principal and Sr. Principal Thermal Scientist:

+ Master's Degree or PhD in related field

+ Design and analysis experience simulating heat transfer within superconducting materials

+ Experience in nanoscale heat transfer and thermal physics in the millikelvin regime

+ Experience in modeling mechanical structures in Solidworks, NX or similar.

+ Active TS/SCI with polygraph security clearance

Salary Range: $127,400.00 - $191,200.00Salary Range 2: $158,600.00 - $238,000.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.