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Our vision is to transform how the world uses information to enrich life for** **_all_** **.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. This team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join this forward-thinking team that is molding the future of technology!

Position Overview

As a Package Silicon Integrator in Advanced Packaging Technology Development (APTD), you will define and validate silicon-package design rules for Micron’s advanced 3D memory products, including HBM and 3DS DRAM. Collaborate with multi-functional teams, including Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality. We manage the advanced packaging roadmap, design rules, test chip/test vehicle pathfinding, TD strategy, program execution, and chip-package interaction resolution.

Responsibilities will include, but are not limited to:

+ Lead package technology integration for silicon test chip projects and support NPIs to meet market timelines.

+ Lead changes to silicon-package design rules, ensuring DFM and DFR requirements.

+ Evaluate wafer design and drive materials/BOM choices to meet chip package interaction needs.

+ Characterize materials from package and die components using mechanical and thermal testing.

+ Develop novel solutions with silicon design, packaging, and product teams to meet system requirements.

Successful candidates for this position will have:

+ Proficiency in interpreting design and simulation methodologies (thermal, mechanical, electrical).

+ Knowledge of Chip Package Interaction (CPI).

+ Experience with 2.5D/3D heterogeneous integration technologies (WLFO, SoIC, CoWoS, WoW, InFO, chiplet/SiP architectures).

+ Expertise in wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle.

+ Leadership in guiding multi-functional teams and driving technical excellence.

Required Experience:

+ Bachelor of Science in physics, materials, mechanical, chemical, or electrical engineering or equivalent experience.

+ 12+ years of experience in semiconductor manufacturing or a related field, with hands-on experience in packaging or frontend processes.

+ Strong understanding of semiconductor process integration and process development.

+ Validated project management skills and experience driving multi-functional technical teams.

Preferred Experience:

+ Experience with advanced memory packaging

+ Master's Degree or PhD degree is preferred or equivalent experience

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$144,500.00 - $313,000.00

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your **right to work click here. (http://www.justice.gov/crt/worker-information)**

To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.