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About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Summary of Role:

This hands-on Product Engineering role will deliver industry leading electro-optical transceiver s using GF ’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form fact ors meeting customer requirements. The candidate will bring a strong focus on functional product requirements to meet or exceed datacom industry standards . Define packaging solutions for customers using a d eep knowledge of package design arch it ecture tradeoff s . CPO is one of the complex archite ctures that will be a focus of activities. Influence packaging technology development direction to ensure readiness to meet future customer requirements .

A successful candidate would possess product characterization exper tise for photonic and electronic packages . It is expected that co-packaged options packaging solutions will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters and 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding .

Responsibilities:

+ Defines p ackaging solutions to meet customer product specifications and cost , yield, and reliability targets.

+ Drive technology and product qualifications from inception through release to production.

+ Assesses product characterization data to ensure functional targets are met.

+ Drives Test, Design for Test solutions , and methods of fault isolation.

+ Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concept s.

+ Driving SiPh ad vanced packaging product innovations, design enablement for customers , and efficient manufacturing processes internally and with OSAT ecosystems .

+ Provides tools and complex analysis of quality issues and associated financial implications

+ Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customer s and market to avoid costly re-designs .

+ Drives discipline and qualification robustness through a consistent global qualification process

+ Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:

+ P erform project management and data analysis

+ Identify and resolve process integration issues and related problems

+ Develop custom or derivative processes to meet customer needs

+ Support new designs with module characterization and design rul e de velopment

+ Work with cross function teams to resolve technical & yield concerns

+ Develop and improve test structures that enable fast and rigorous characterization of process

+ Drive CIP (Continuous improvement plans) to deliver organizational goals

+ P erform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications:

+ MS, or PhD + 5 or more years of experience

+ Experience in bringing packaged products from development into production .

+ Knowledge of test methodologies and test solutions

+ Strong written and spoken English communication skills

Preferred Qualifications:

+ Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosyste m .

+ Experience completing failure analysis, design of experiments, & packaging process integration.

+ Expert in chip package interaction for 2D, 2.5D, 3D , 3.5D SiPh advanced packaging .

+ Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

Expected Salary Range

$107,400.00 - $204,500.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law