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Job Description

This person will be conducting triage and failure analysis on PC devices that come in from the field to root-cause complex electrical related failures. The Engineer will use knowledge of PC/system board architecture, as well as schematics to debug and root cause issues on devices from the field. This includes determining what is wrong with the unit (design issue, manufacturing issue, component issue, etc.), working the issue to isolate/root cause the point of failure, and providing the findings/recommendations to the quality engineering staff with the end goal of preventing future failures. The failures will be related to, but not limited to: PC motherboard and electrical components, "No Power", "No POST", etc.

This role will be onsite at the HP facility in Bangalore, India. Typical work schedule is Monday-Friday, 9am-6pm IST (excludes major holidays).

Compensation range: 687000-1,100,000 INR

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to [email protected] learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

Skills and Requirements

4+ years of experience performing failure/root-cause analysis on PC devices down to the board-level (sub-assembly components, ICs, etc.)

Strong RCA (root cause analysis) abilities and techniques.

Strong knowledge of PC design/architecture and electrical concepts

PC teardown ability without compromising failure evidence

Ability to read and interpret schematics and board layouts

Strong experience using tools such as oscilloscopes, multi-meters, logic analyzers, protocol analyzers, digital microscopes, etc.

Strong ability to identify shorts and debugging PC component/board-level issues

Ability to report detailed findings (good written & verbal communication)

Bachelor's degree in Technology or Engineering (preferably Electrical related) IPC certifications

Experience with Cadence Allegro board viewer software

Experience or knowledge with system board design/architecture

Previous HP experience or experience working on HP branded devices

Soldering/rework experience