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Job Description:

Help bring to market new products incorporating Film Bulk Acoustic Resonator (FBAR) filters. Work with an energetic team in a fast-paced environment of a rapidly expanding product line. Projects can involve wafer fab process development, device physics modeling, device and module characterization, mechanical modeling, assembly process development, reliability testing, test development, and statistical analysis.

Responsibilities include:

-Yield analysis and improvement, of both individual filters and complex modules incorporating both FBAR filters and amplifiers.

-Characterize process and product improvements. Drive new process and product improvements. Define fab process capability requirements for product needs.

-Interface with wafer fab engineering for chip and process development.

-Selection of appropriate sub-assembly tests (electrical and/or mechanical) to optimize overall product cost, and the development, specification, and implementation in volume production of those tests.

-Design and implementation of RF or DC electrical tests to improve product reliability.

-Develop and transfer to volume production RF die probing techniques to improve accuracy of identifying good dice and improve module yield.

-Improve high-volume RF test fixtures and test methods to improve measurement accuracy and ensure product spec compliance

-Ensure robust yield and quality on new products while maintaining aggressive time to market schedules

Education and experience:

+ Masters degree in Electrical/Electronics/Mechanical Engineering or related field of study

+ 6 + years of related experience.

The requirements for this job are a broad range of skills and the ability to delve deeply into specific technical areas while maintaining a broad integration perspective. Adaptability to understand and solve new problems is important. Good collaboration skills are a must for working with various teams the world. Specific skills desired for this job include strong quantitative analysis skills, understanding of semiconductor and/or acoustic device physics, thorough understanding of RF characterization and testing, MEMS or mechanical engineering expertise, clear communication skills, and ability to work effectively with diverse teams spanning multiple locations around the world. Occasional travel may be required.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $120,000 - $192,000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library (http://www.broadcom.com/videos) and check out our Connected by Broadcom (https://www.broadcom.com/support/resources/video-webinar-library?channel=5c9658f7c1d34eca91c6cc16178e5b1b&video=7d72b04ea50046a394e682fab640ce20) series.

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