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Job Description

You don t see it, but it s there. Our employees work on the world s most advanced electronics

from the latest GPS guidance systems to powering the Mars Rover to protecting the F- 35 fighter jet. At BAE Electronic Systems, you ll be among the brightest minds, working on the aerospace and defense industry s most difficult problems. Drawing strength from our

differences, we re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first exemplified by our mission: We Protect Those Who Protect Us

In this role you will be providing technical support to Manufacturing Operations microelectronics packaging team in the form of enabling and improving the flow of product through manufacturing utilizing the disciplines of industrial and mechanical engineering. This role will provide technical guidance and leadership to the micro group for processes and materials

+ New product introduction support and Design for Manufacturing analysis.

+ Data analysis and process improvement in areas

+ Support of new manufacturing technologies and equipment selection

+ Future road map creation and execution in area

+ Capacity and capability analysis for the area

+ Subject Matter Expert on microelectronics packaging processes and materials for the Cedar Rapids Facility.

+ Responsible for technical problem definition and solution in manufacturing environment. Interfaces with design engineering on incorporating changes to the designs which improve manufacturability.

+ Determines the most efficient sequence of operations and work flow, and establishes methods for maximum utilization of production facilities and personnel

+ Conducts studies pertaining to cost control, cost reduction, inventory control through the application of Lean principles.

+ Determines the most efficient sequence of operations and work flow, and establishes methods for maximum utilization of production facilities and personnel.

+ Perform assignments requiring use and application of standard engineering economics and product development principles and techniques.

+ Maintain awareness of the technological state-of-the-art and of the Company's competitive position in the micro electronics areas.

+ Understands and considers how facility design and layout for manufacturing processes and equipment affect economic factors, process flow, operator efficiency and comfort in performance of job duties.

+ Individual job duties may vary.

Because of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full-time on site. This means work will be conducted on location at a BAE Systems facility 100% of the time.

Required Education, Experience, & Skills

+ Bachelor's STEM Degree

+ 10 Years work experience

+ 5 Years direct micro electronics experience

+ Specifically related to lithography and plating

+ Ability to obtain Secret Level Security Clearance

Preferred Education, Experience, & Skills

+ Detailed knowledge and understanding of microelectronics industry standards.

+ Lithography, plating, flip chip, SMT, wafer level packaging

+ Experience with New Production Introduction (NPI) and evaluation of new designs for DFM

+ Knowledge and understanding of of failure analysis equipment and techniques

+ SIR, FTIR, SEM, X-ray, etc

+ Materials science background or knowledge

+ Programming and troubleshooting automated equipment.

+ Capital equipment specification, purchase, and integration

+ Tool and fixture design

+ Lean and Six Sigma

+ Cpk capability studies, Gage R&R, data analysis

+ US Citizen and Security Clearance or the ability to obtain one

Principal Industrial Engineer

116819BR

EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression