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Microsoft Silicon and Cloud Hardware Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Skype, OneDrive, and the Microsoft Azure platform globally with its server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

Are you passionate about working on cutting edge technology in a team that embodies the growth mindset? Are you hoping to join an organization which is built on a mission “To empower every person and organization on this planet to achieve more”?

The Firmware Center of Excellence is responsible for Hardware/Firmware for Azure infrastructure. We are working on the next generation 1P AI and compute silicon with a focus on innovation in firmware technology to secure Azure infrastructure for Microsoft and their customers.

We are looking for a **Firmware Development** **Engineer** with a background in firmware development in embedded systems.

Responsibilities

+ Architecting software at various layers of the stack, from boot ROMs to drivers to runtimes.

+ You will be contributing to all phases of product development, from design through manufacturing and productization.

+ You will contribute to the architecture and design of various firmware components, including driver interfaces (PCIe, SPI, I2C, I3C), system libraries needed for SoC bring-up, protocol and feature development of low-level hardware.

+ Perform system-level debugging and troubleshooting to identify and resolve complex hardware/firmware-related issues.

+ Collaborate with cross-functional teams including hardware architects and engineers, software developers, validation & integration and product managers to define firmware requirements and specifications.

+ Stay up to date with industry trends and advancements in cloud firmware technologies and provide recommendations for improvement.

Qualifications

Required Qualifications:

+ Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 2+ years technical engineering experience

+ OR equivalent experience.

+ 1+ years of Experience in FW and or Embedded Software development experience, particularly in a multi-core platform environment

+ 1+ years of programming experience in C/C++ Solid understanding of computer architectures including processors, buses, and memories.

+ Responsible for collaborating with cross-functional teams to debug the issues at the cross section of multiple sub-systems.

+ Demonstrated experience of hardware and firmware architecture, design, and coding for solutions at scale

+ Problem-solving and analytical skills.

+ Experience working with multiple teams on root cause analysis, troubleshooting, and debugging skills resulting into solving complex Hardware/Firmware interface issues.

+ Self-motivated and able to work independently.

+ Proficient communication and collaboration skills, with the ability to work effectively in cross-functional teams.

Other Requirements:

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to, the following specialized security screenings:

+ Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.

Preferred Qualifications:

+ Knowledge of operating systems including drivers, memory management, boot loaders, and scheduling.

+ Basic Verilog (or any other HDL) programming & waveform debugging

+ Debugging skills with GDB or equivalent.

+ Experience developing firmware in pre-silicon environments and on test benches.

+ Shipped products running firmware or embedded software you’ve written.

+ Experience with one or more of these: drivers, DMA, PCIe, NVMe, image video encoders/decoders, memory controllers/training, boot flows, or power management.

Firmware Engineering IC3 - The typical base pay range for this role across the U.S. is USD $85,100 - $169,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $112,000 - $185,300 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: US corporate pay information | Microsoft Careers (https://careers.microsoft.com/v2/global/en/us-corporate-pay.html)

Microsoft will accept applications for the role until October 20th, 2025.

\#SCHIE

Microsoft is an equal opportunity employer. Consistent with applicable law, all qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations (https://careers.microsoft.com/v2/global/en/accessibility.html) .