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Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary:

$179,500.00 - $246,500.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits (https://hrportal.ehr.com/applied/) .

About the Role

We are working on exciting projects, connecting materials to systems, to drive new innovations that enable a wide range of advanced Logic-Memory devices and technologies, and associated material and processes interactions. You can be part of this cutting-edge modeling and design team, where you will have the opportunity to model and simulate new technologies that answers the continuous demands for scaled devices, denser interconnects that significantly improves the system Power, Performance and Area (PPA).

We are looking for an expert, highly experienced Senior Engineer to join our Advanced Device Modeling team **onsite in Santa Clara, CA.**

This primary responsibility of this position will be to focus on DTCO modeling to support the unit process and integration flow development for next generation logic and DRAM nodes. You will play a key role in shaping the future of advanced logic and DRAM technologies by providing DTCO simulation-driven insights that influence materials, process and design decisions.

This position offers the opportunity to work at the forefront of semiconductor innovation, collaborating with engineers and researchers across multiple business units including design, process integration, reliability, and manufacturing.

Key Responsibilities

+ Development of TCAD process and device models to enable predictive analysis for advanced logic (FinFET, GAA, CFET) and DRAM architectures (6F2, 4F2 VCT and 3D DRAM)

+ Development and modification of speculative process integration schemes and risk/benefit assessment.

+ Extraction of compact model representation of TCAD simulated devices.

+ Layout development/design of standard logic cells and DRAM array

+ Interconnect modeling and parasitic resistance and capacitance extraction

+ SPICE modeling and PPA projection for benchmark logic circuits & blocks and DRAM array / periphery

+ Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.

+ Support technology roadmap development by evaluating new materials, interconnect structures, process flows and design.

+ Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of electrical performance and reliability.

+ Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy.

+ Document and present simulation methodologies, results, and recommendations to both technical and executive audiences.

+ Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies.

Required Qualifications

+ Master’s or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field.

+ 5–10 years of hands-on industry experience with Synopsys 3D TCAD process, device, parasitic extraction and spice modeling tools towards logic or memory technology development.

+ Strong fundamental understanding of semiconductor device physics related to logic and DRAM technologies.

+ Familiarity with logic (FinFET, GAA and CFET) and DRAM process integration flows (FEOL / MOL / BEOL) and 3D device structures.

+ Experience with logic benchmark circuits and PPA evaluation methodologies.

+ Experience with DRAM array and periphery operation.

+ Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.

+ Excellent analytical, problem-solving, and communication skills.

+ Proven ability to work independently and collaboratively in a fast-paced, cross-functional environment.

+ Strong problem-solving abilities in interdisciplinary areas

+ Ability to present scientific and/or experimental results in a concise and convincing manner

+ Desire to stay up to date with industry challenges and recent advancements

+ Passionate and highly motivated to learn new things

Preferred Qualifications

+ Experience with device and circuit level reliability modeling

+ Recent experience with writing research papers for conference and journal publications

+ Experience with standard cell characterization, RTL synthesis, DRC/LVS and place-and-route and timing analysis flows

+ Experience in calibration to hardware/measurements and correlations

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

No

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site (https://www.appliedmaterials.com/us/en/careers.html) accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.