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RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE TYPE: Secret

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

**Northrop Grumman Mission Systems' (NGMS)** Microelectronics Center is seeking an **Advanced Packaging** **Program Manager, Level 2** to support the Advanced Packaging Operating Unit (OU) in **Apopka, FL** .

For more than 70 years, Northrop Grumman’s Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

The Advanced Packaging OU develops and deploys next-generation microelectronics packaging technologies for future defense & commercial systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our customers across these industries.

The selected candidate will be responsible for leading proposals and execution for semiconductor wafer post-processing. Their primary objective will be developing advanced packaging proposal solutions, introducing new products and processes, and delivering all contractual requirements to our customers on-cost and on-schedule. They will oversee the development and achievement of all technical objectives, as well as numerous contractual requirements including: managing cost, schedule, and technical performance; leading interfaces with internal and external customers, and company support organizations; supporting insertion of these technologies into customer use cases; identifying volume growth and cost reduction opportunities; and interfacing with technical leadership across our customer base to identify technology needs and timelines to support next-generation microelectronics systems.

What You'll Get to Do:

Program Managers are responsible for leading all phases of the program life cycle from inception (proposal technical solution and cost development) through startup, execution, and completion. Primary responsibilities are the management of cost, schedule, and technical performance of company programs and include, but are not limited to:

+ Developing new business opportunities and customer relationships through long term strategic planning, capture planning, and new technology insertion and business plans.

+ Leading engagements with customers to develop, mature, and deploy advanced packaging solutions.

+ Leading and directing cross-functional teams to meet program cost, schedule and technical performance objectives across both development and production efforts.

+ Measuring and reporting program performance.

+ Delivering proposals and presentations to customers, executive management and other program stakeholders.

+ Development and adherence to budget baselines utilizing Earned Value Management (EVM) or similar cost & schedule control methodologies and tools.

+ Identifying, allocating and managing program resources, including workforce planning.

+ Managing Northrop Grumman capital and government/customer supplied property or information (GFE, CFE, etc.)

+ Managing suppliers & subcontractors to meet program objectives.

+ Adherence to all internal processes, policies, and applicable industry standards.

+ Ensuring teams adhere contract scope, and manages change through control board activities.

+ Development and adherence to master plans and schedules.

+ Conducting thorough risk & opportunity management practices including identification, mitigation and realization.

Basic Qualifications:

+ Bachelor’s Degree and 8+ years', Master’s Degree and 6+ years', or a PhD and 3+ years of relevant experience supporting U.S. Government contracts and customers and/or project management in commercial industry.

+ Demonstrated experience leading teams in the performance of tasks on schedule, at cost and achieving all requirements as either a program manager, project lead, integrated program team or cost account manager.

+ Technical background in semiconductor & microelectronics design, fabrication and/or advanced packaging.

+ Demonstrated expertise in verbal and written communication to customers, program management, and technical teams.

+ Experience with organizing, writing, and delivering technical artifacts including white papers, proposals, and presentations.

+ Demonstrated experience with Earned Value Management (EVM), Scheduling, and Agile Principles.

+ Ability to travel domestically as required.

+ U.S. Citizenship required.

+ Ability to obtain and maintain a U.S. DoD Secret Clearance.

Preferred Qualifications:

+ Master’s or Ph.D. degree in a science or technology field related to microelectronics and semiconductors.

+ Demonstrated experience managing the research, development, and manufacturing of microelectronics and advanced packaging.

+ Experience interfacing with U.S. Government, defense, and commercial customers to define technical solutions for their microelectronics fabrication and/or packaging needs

+ Detailed knowledge of those customers' planning, program creation, and program management processes.

+ 5+ years of experience leading semiconductor technology development or production programs, operations management, knowledge of RF & digital system products, capabilities and enabling technologies.

+ Familiarity with Federal Acquisition Regulations (FAR) and Defense Federal Acquisition Regulations (DFAR).

+ Active U.S. DoD Secret or Top Secret clearance.

Primary Level Salary Range: $135,100.00 - $202,700.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.