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Job Description

Job Description:

Join our team at BAE Systems as a Microelectronics Packaging Design Engineer intern and work on cutting-edge projects that shape the future of aerospace and defense. Our hybrid work format allows for a balance of collaborative in-person and independent remote work.

About Us:

At BAE Systems, we're dedicated to innovating for the future and protecting those who protect us. Our employees work on the world's most advanced electronics, from saving emissions in major cities to powering the Mars Rover. We're a team of bright minds working together to solve the industry's most difficult problems.

Internship Summary:

As a Microelectronics Packaging Design Engineer intern, you'll work closely with experienced engineers to design, develop, and qualify state-of-the-art miniaturized electronic devices. This is an excellent opportunity to apply your knowledge of engineering principles to a dynamic and fast-paced field.

Responsibilities:

+ Assist in the development of microelectronics packaging concepts and technologies

+ Participate in product development activities, including packaging design and road mapping efforts

+ Contribute to program pursuits and bid estimates

+ Support prototype package builds and evaluation efforts

+ Assist in the qualification of microelectronics packages

+ Participate in failure analysis for microelectronics packages

+ Provide support for factory transition of products and manufacturing of microelectronics assemblies

Requirements:

+ Currently pursuing a degree in Electrical, Aerospace, Mechanical, or Materials Engineering

+ Strong foundation in engineering principles and materials science

+ Interest in microelectronics packaging design and development

+ Excellent communication and teamwork skills

What We Offer:

+ Opportunity to work on cutting-edge microelectronics packaging design and development projects

+ Collaborative and dynamic work environment

+ Professional development and growth opportunities

+ Competitive stipend and benefits package

Required Education, Experience, & Skills

+ US Person

+ All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)

+ Currently pursuing a degree in Engineering with focus on Electrical, Aerospace, Mechanical, or Materials Engineering

Preferred Education, Experience, & Skills

+ Microelectronics design and manufacturing assemble

+ Microelectronics packaging materials and materials properties

+ Electronic component reliability testing

+ Post wafer fabrication processes

+ Failure analysis techniques

+ Additive manufacturing

+ Wafer fabrication processes

+ Advanced thermal packaging design

+ RF packaging design

Pay Information

Full-Time Salary Range: $53560 - $72306

Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.

Temporary employees generally are not eligible for BAE Systems benefits, but can elect to participate in the 401(k) savings plan. Temporary employees working 20 hours per week are eligible for medical benefits, the employee assistance program, and business travel accident insurance.

Microelectronics Packaging Intern - Summer 2026

117811BR

EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression