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Job Description:

Product Engineering Manager, Optoelectronics

BROADCOM – Optical Systems Division (OSD)

Position Overview** **:

Broadcom is seeking an experienced Wafer Fab Engineering Manager to lead the Product Engineering Team. In this full-time position with competitive pay and excellent benefits, the successful candidate will interface with departments throughout the company to facilitate the efficient and profitable manufacture of microelectronic laser and detector products that are critical to Broadcom’s success as a leading manufacturer in the optoelectronics industry. The candidate will work energetically within a collaborative environment to lead a team that is responsible for optimizing yields at diverse operations in the manufacturing process and will oversee development activities as well as new product introduction.

Responsibilities** **:

+ Supervising a team of 8 – 12 direct reports involved in

+ analyzing and improving end-to-end process yield, testing yield, and manufacturing efficiency;

+ performing failure-mode analysis.

+ Supporting manufacturing operations by clarifying design requirements, predicting yields, and determining viability of nonconforming product, and by coordinating the smooth transition of development products into high-volume manufacturing.

+ Collaborating with the design organization to set up and oversee experiments involving wafer and chip fabrication for new products.

+ Implementing software applications and overseeing database activities that support manufacturing.

+ Driving process control through SPC and quality system practices.

+ Using design of experiments (DOE) for process optimization and for the qualification of new processes and tools.

Qualifications, Skills and Expectations** **:

+ Master’s Degree in engineering, mathematics, or physical science, with 12+ years’ experience in semiconductor manufacturing, or comparable combination of education and experience.

+ Preferred: Ph.D. in engineering, mathematics, or physical science, with 7+ years’ experience in semiconductor manufacturing.

+ Three years’ personnel management experience (5 – 15 direct engineering reports).

+ Uses both formal and informal (lead-by-example) leadership skills to drive performance and improvement.

+ Applies key performance indicators; possesses the ability to create a metrics-driven organization.

+ Excellent written and oral communication skills.

+ Strong problem-solving ability; a mindset that is detail-oriented and analytical.

+ Experience with various software packages, including JMP, MS Office, and G-Suite.

+ Willingness/ability to learn and use internally developed custom software.

+ Perseverance, a positive attitude, and a bias toward action.

+ Ability and flexibility to work effectively with cross-functional teams, including team members at other locations which require weekly off-hours meetings.

Preferred** **:

+ Experience in InP laser semiconductor product development and manufacturing.

+ Experience interacting directly with external customers.

+ Experience directing manufacturing activities at external foundries and/or contract manufacturers.

+ Experience with statistical software and analysis, including statistical process control.

+ Experience with using SQL queries for data mining, analysis, and presentation.

+ Knowledge and application of lean manufacturing methods.

+ Wafer fabrication experience in a manufacturing environment.

About Broadcom Inc. and the Breinigsville Facility** **:

Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom's category-leading product portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial.

The Breinigsville, PA, manufacturing location was created by AT&T in the late 1980s as Bell Laboratories’ world headquarters for optoelectronics. Through a series of acquisitions, this facility is now an integral part of Broadcom’s Optical Systems Division, manufacturing indium phosphide lasers and detectors that support telecommunications and datacenter customers throughout the world. Located in the Lehigh Valley region of Pennsylvania just outside of Allentown, our high volume, 24/7 manufacturing facility fabricates devices that enable fiber optic communication and datacenter expansion.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $127,100 - $203,400.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

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