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Senior Packaging Engineer
- Teledyne (Milpitas, CA)
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Be visionary
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
Senior Packaging Engineer
**Location:** Milpitas, CA or Garland, TX (On-site)
Your Role in the Company
As a Senior Packaging Engineer at Teledyne HiRel Electronics, you’ll play a critical role in shaping the future of aerospace and defense electronics. You will lead packaging design initiatives, ensuring our products meet stringent reliability standards while driving innovation in integrated circuit packaging. Your expertise will help us deliver cutting-edge solutions to meet customer demands and industry trends.
What You’ll Do
+ Lead the design and development of new integrated circuit packages (plastic, ceramic, hybrid).
+ Translate customer requirements into optimized packaging solutions.
+ Collaborate with production and marketing teams to ensure feasibility and cost-effectiveness.
+ Assess and negotiate design trade-offs with customers and internal teams.
+ Research technology trends and recommend improvements for high-reliability applications.
+ Review and generate mechanical drawings for custom and standard packages.
+ Interface with customers and suppliers to represent Teledyne with authority and expertise.
+ Maintain knowledge of MIL-STD 883 and 1835 standards and apply them to designs.
What You Need
+ Strong knowledge of semiconductor electronics and IC packaging – **required** .
+ Master’s degree in engineering or equivalent experience (8+ years) – **required** .
+ Experience in aerospace and defense segment – **preferred** .
+ Familiarity with packaging materials and high-reliability applications – **required** .
+ MIL-STD 883 and 1835 experience – **preferred** .
+ Ability to work independently and on-site – **required** .
+ US citizenship and valid passport – **required** .
+ Ability to travel up to 10% domestically and internationally – **required** .
What We Offer
+ Opportunity to work on advanced aerospace and defense technologies.
+ Collaborative team environment with strong technical leadership.
+ Competitive compensation and benefits package.
What Happens Next
Apply today to join a team committed to innovation and excellence. After submitting your application, our recruitment team will review your profile and contact you via email or phone for next steps.
_US citizenship and ability to obtain DoD security clearance may be required._
Salary Range:
$113,600.00-$151,400.000
Pay Transparency
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.
You may not realize it, but Teledyne enables many of the products and services you use every day **.**
Teledyne provides enabling technologies to sense, transmit and analyze information for industrial growth markets, including aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, energy, medical imaging and pharmaceutical research.
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