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Our vision is to transform how the world uses information to enrich life for** **_all_** **.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

Position Overview:

As a Process Integration Engineer for Advanced Packaging, you will own the end-to-end integration of next generation package architectures like 2.5D, 3D stacking, HBM memory integration, and hybrid bonding. You’ll lead new technology development and technology transfer, design DOEs, and analyze yield and reliability. You will coordinate across device, design, process, equipment, test, and manufacturing teams to deliver high performance multi-die technology. This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others.

Responsibilities:

+ Own package-level process integrationacross2.5D/3D flows(wafer-to-wafer,chip-to-wafer,advanced interconnects), defining specs and process windows that meethigh performancetargets for HPC/AI products.

+ Develop and integrate semiconductor manufacturing processes; Design,optimize, and implement fabrication flows that seamlessly integrate multiple steps (lithography, etch, deposition, diffusion, CMP, and thin films) into cohesive production processes.

+ Plan, run, and analyze targeted experiments tovalidatenew materials, process parameters, and design rules to improve yield and device performance. Design and execute DOEson bonding, underfill, molding,stacking, andintegrationsteps; ApplySPCtoparametricsand yield detractors and close the loop with corrective actions.

+ Analyze yield, performance, and defect data.Utilize big data, physical, electrical, and defect data to root-cause process weaknesses, yield issues, and tool variances. Employ SPC and advanced analytics.

+ Lead technology transferfrom TDto TDandHVM. Establishmask rules, materials,tool readiness, baseline qualification, andtechnology validationplans.

+ Hybrid bonding (CuCu +dielectric) integration; Set surface prep,planarityandalignmentrequirements, qualifyW2W/C2Wflows, and track defectivity and reliability.

+ Thermocompression µbumpflows; Optimizeunderfill, TC bonding windows, and pillar/bump geometries forhighI/O assemblies.

+ HBM and interposer systems; Co-optimizeTSV/interconnectrouting and thermal paths to meet bandwidth/latency targets. Align package floorplans withchipletpartitioning.

+ Warpage engineering; Predict and mitigate wafer/diewarpage via modeling,cure shrinkagecontrols, and material/process levers. Validatewith inline metrology.

+ Metrology and inspection; DeploySAM,IR microscopy, and emergingXRD warpage mappingto correlate process, defects, and reliability.

Minimum Qualifications:

+ MS or PhDin Materials Science, Chemical Engineering,or relatedfield

+ 10+ years experience in advanced packaging technology development (2.5D/3D, HBM)

+ Hands-on knowledge ofadvanced interconnects/TSV,die stacking,underfill,molding, andbondingflows

+ ProficiencyinDOE/SPCand data analysis (e.g.,JMP/Minitab/Python);demonstratedroot-causeproblem solving and yield improvement.

+ Experience withmetrology: SAM, Xray/CT, IR, warpage profilers (shadow moiré/DIC)

+ Strong communicationskills; ability toleadcross-functionalteamsand drive actions to closure infast-pacedenvironments.

+ Direct experience withhybrid bondingintegration and reliability (W2W/C2W)

+ Demonstrated success inHBM and logicintegration(includingthermalco-optimization)

+ Warpage modelingand inline correlation experience

+ Deep familiarity with underfills, reworkable strategies, and TC bonding optimization

Candidates must have experience and the ability to adhere to cleanroom environment/EHS protocols. This role entails occasional travel to sites in Asia for integration development and transfer support.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your **right to work click here. (http://www.justice.gov/crt/worker-information)**

To learn more about Micron, please visit **micron.com/careers**

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert **:** Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.