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Introduction

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.

Your role and responsibilities

IBM continues to make significant investments in advanced semiconductor packaging. This role is being created to oversee the diverse activities related to IBM's significant investment in Fan-out Wafer Level Packaging ("FO-WLP") to be leverage by both IBM as well as IBM Bromont OEM business partners mainly as a platform to implement organic interposers with embedded bridges for HPC/AI applications.

The role is to become the single point of contact for all things related to the on-going FO-WLP technolony implementation.

* OWN overall FO-WLP related Business Development efforts

* OWN building and maintaining relationships with ecosystem partners

* OWN relationship with source IP vendor and develop monetizing plan for foreground IP

* OWN foreground IP management

* MONITOR closely line and process bring-up

* ENSURE bring-up schedules align with Business Development pursuits and overall business plan

Required technical and professional expertise

* BS in engineering or technology related field

* Significant experience in semiconductor industry with emphasis on advanced packaging

* Experience with FO-WLP technology

* Experience in managing complex, multi-organizational situations

* Business Development experience in semiconductor packaging

* Program Management experience in the semiconductor domain

Preferred technical and professional experience

* Deep experience in FO-WLP packaging, particularly as a chips-last format.

* Graduate degree in engineering

* Senior level engineering management experience

* Experience navigating C-Suite executive discussions

IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.