"Alerted.org

**Are you looking to power the next leap in the exciting world of advanced electronics?** Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.

At **Qnity** , we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.

We are looking for a highly motivated scientist to join our Advanced Packaging New Product Development team. This role will focus on designing and optimizing electroplating formulations for Copper (Cu), Solder, and Nickel (Ni) applications used in next-generation semiconductor packaging technologies such as HBM, chiplets, and 3D integration.

Key Responsibilities

+ Design and develop electroplating chemistries for Cu, solder, and Ni applications in advanced packaging.

+ Optimize additives, grain refiners, and stabilizers to achieve target properties (e.g., uniformity, low defectivity, controlled grain structure).

+ Ensure compatibility with high-aspect-ratio TSVs, microbump Cu/Ni/SnAg, and hybrid bonding requirements.

+ Collaborate with process engineers to integrate formulations into plating tools and manufacturing workflows.

+ Support scale-up from lab to pilot and high-volume manufacturing.

+ Perform electrochemical analysis (CV, Chronopotentiometry, Chronoamperometry, LSV, etc) and surface characterization (SEM, EBSD, XRD).

+ Evaluate mechanical, electrical, and reliability performance of plated layers.

+ Work closely with customers to align formulation performance with device requirements.

+ Partner with plating tool OEMs to qualify chemistries and optimize process windows.

+ Identify opportunities for novel formulations and file patents to protect intellectual property.

+ Stay current with industry trends in advanced packaging and electroplating technologies.

Qualifications

+ Bachelor’s degree in Chemistry, Materials Science, Chemical Engineering, or related field.

+ 5+ years in electroplating chemistry development for semiconductor or electronics applications preferred.

+ Strong background in Cu, solder, and Ni plating formulations and additive chemistry.

+ Hands-on experience with electrochemical characterization and plating process optimization.

+ Expertise in grain engineering and surface chemistry.

+ Familiarity with reliability testing and failure analysis.

+ Strong analytical and problem-solving skills.

+ Excellent communication and collaboration abilities.

Preferred

+ Experience with advanced packaging technologies (HBM, chiplets, 3D IC).

\#LI-LH1

\#LI-Onsite

Join our Talent Community (https://careers.qnityelectronics.com/us/en/jointalentcommunity) to stay connected with us!

Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information (https://www.qnityelectronics.com/accessibility.html) .

Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page (https://careers.qnityelectronics.com/us/en/compensation-and-benefits-final) .

We use Artificial Intelligence (AI) to enhance our recruitment process.

The Pay range for this role is $78,960.00 - $124,080.00 Annual

**How Base Pay is Determined:** Qnity has job leveling frameworks that help organize roles based on progressive levels of responsibility, proficiency and qualifications. Each role has an associated pay range (or an established pay rate for some roles) based on the competitive market in each country where we operate. Each individual’s pay is based on a variety of factors, including their role and the associated pay range for that role, their geographic location (i.e., country, state, metropolitan area), as well as their skills, experience, education and certifications, and performance.