• Planner IV-Environmental Review - Port of

    City and County of San Francisco (San Francisco, CA)
    …of Early Projects funded through the 2018 Proposition A Seawall Earthquake Safety Bond to reduce near-term seismic and flood risk and strengthen the Embarcadero ... disqualify you from this recruitment or future job opportunities. Maritime Transportation System (MTS) Access Candidates for employment with the San Francisco Port… more
    City and County of San Francisco (09/04/25)
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  • Manufacturing Assembler

    Teledyne (Mountain View, CA)
    …equipment, such as die-attached station, wedge bonder, ball bonder, gap welder, bond -pull tester + Operating or be-trained with automation, such as reflow brazing ... system , auto wedge-ball bonder + May perform other assembly...and other report forms + Familiar with Window operating system and Microsoft Office + Flexible working time and… more
    Teledyne (08/28/25)
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  • Project Manager (Education)

    Harris & Associates (Los Angeles, CA)
    …in accordance with district and program policies and procedures for College construction bond operations + Train team on all PMO policies and procedures + Follow ... and successfully execute program Quality Management System + Report and collaborate with Program Management Office...+ Experience with using a web based project management system such as Proliance and/or Procore. + OSHA-10 certification… more
    Harris & Associates (08/13/25)
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  • Superintendent of Street Environmental Services-…

    City and County of San Francisco (San Francisco, CA)
    …cleans and greens the right of way; maintains civic buildings; manages multi-million-dollar bond programs; trains people for jobs; keeps the right of way free of ... Vehicle and Equipment Management: Manage and provide oversight of our "Keywatch" system to monitor vehicle use, periodically review vehicle use GPS programs,… more
    City and County of San Francisco (08/12/25)
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  • Gift Administrator

    Cedars-Sinai (Los Angeles, CA)
    …(ie gift collection, gift review and categorization, tracking, batches, commitment, system scripts, receipting, etc.). + Handle entry of complex and sensitive ... Basic financial knowledge including billing information. + Knowledge of stocks and bond transaction procedures. + Skills in working independently, be resourceful and… more
    Cedars-Sinai (07/24/25)
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  • Senior Package Layout Engineer - Hardware

    NVIDIA (Santa Clara, CA)
    …substrate breakout patterns for ASIC packages. + Optimize package pinout incorporating system level trade-offs of pins assignment. + Help perform package routing, ... evaluate the Package design goals for size, cost, and system performance. + Develop symbols and CAD library databases...plus + Proven experience in substrate layout of wire bond and flip chip packages, preferred + Significant background… more
    NVIDIA (07/10/25)
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  • Project Controls Analyst II

    AECOM (San Bernardino, CA)
    …**Responsibilities include:** + Works with the company financial and cornerstone systems and processes. + Processing invoices, tracking project expenses, reconciling ... expenses between two accounting systems . + Applies financial terminology, measures, financial data analysis concepts and principles in assignments. + Recognizes… more
    AECOM (08/26/25)
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  • Materials R&D Technician

    SpaceX (Hawthorne, CA)
    …silicones, paints, composites, and thermal protection materials + Setup and operate hot bond composite repair systems + Execute vacuum bag processing, bonding, ... Office suite (Excel, Word, PowerPoint, Outlook), Atlassian JIRA, and work order systems + Strong interpersonal and verbal communication skills to work closely with… more
    SpaceX (07/24/25)
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  • Staff Tool Design Engineer- Level 4

    Lockheed Martin (Palmdale, CA)
    …the fabrication phase of tool designs, see their use into the production system and ensure configuration control is maintained\. Other tasks will include root cause ... composite part families and processes, from layup fixtures to trim fixtures, bond fixtures, and assembly fixtures\. \-Exposure to root cause analysis and continuous… more
    Lockheed Martin (08/21/25)
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  • Staff Semiconductor Process Engineer

    Lockheed Martin (Goleta, CA)
    …execution of advanced Focal Plane Array \(FPA\) including wicking, plasma system , substrate thinning, dicing, Anti\-Reflection \(AR\) coating, and flip\-chip bonding ... efficiency, and throughput and methodologies used to precisely align and bond detector arrays and readout integrated circuits \(ROICs\), creating high\-performance… more
    Lockheed Martin (08/21/25)
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