- Molina Healthcare (Buffalo, NY)
- …Molina's growth strategy and positioning the company for success in Medicaid, CHIP , DSNP, and Marketplace procurements. Reporting to the Vice President, Business ... for success in competitive procurements. The Director partners with the VP Market Development to provide thought leadership and subject matter expertise, identifying… more
- Corning Incorporated (Corning, NY)
- …in glass and other platforms for large scale optical circuits, shuffles, fiber to chip coupling, and chip -to- chip interconnects. Knowledge in the areas of ... of semiconductor manufacturing and packaging processes like thin film processing, flip- chip assembly, laser processing can be beneficial. + Understanding of optical… more
- Global Foundries (Malta, NY)
- …candidate will bring a strong focus on thermal, mechanical, electrical , and optical chip package co- design . Focus on product and module performance, reliability , ... electrical interconnect solutions including Copper RX, Copper uPillar , chip -on-wafer and chip on substrate using a...technology performs to the expectations of customer s and market to avoid costly re-designs . + Ensures standardization… more
- Global Foundries (Malta, NY)
- …focus on packaging and assembly materials used for each step in SiPh Flip Chip packaging, including laminate buildup, optical adhesives , interconnect metal l urgy , ... electrical interconnect solutions including Copper RX, Copper uPillar , chip -on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. Responsibilities: + Defines… more
- Global Foundries (Malta, NY)
- …strong focus on assembly process interactions for each step in a SiPh Flip Chip package towards delivery of product solutions . Focus on product and module ... 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip -on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. Responsibilities: + Drives… more
- Global Foundries (Malta, NY)
- …3D electrical interconnect solutions including Copper RX, Copper uPillar, chip -on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. Essential Responsibilities: ... performs to the expectations of a given customer or market to avoid costly re-designs + Ensures standardization of...for data centers, automotive and communications + Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced… more
- Global Foundries (Malta, NY)
- …3D electrical interconnect solutions including Copper RX, Copper uPillar , chip -on-wafer hybrid bonding and wafer-to-wafer hybrid bonding . Responsibilities: + ... technology performs to the expectations of customer s and market to avoid costly re-designs . + Drives discipline...of experiments, & packaging process integration. + Expert in chip package interaction for 2D, 2.5D, 3D , 3.5D… more
- Amazon (New York, NY)
- …inference - Experience with GPU programming (eg TensorRT-LLM) or Amazon AI chip programming (Trainium) - Experience with Python, PyTorch, and C++ programming, ... this position ranges from $151,300/year in our lowest geographic market up to $261,500/year in our highest geographic ...market up to $261,500/year in our highest geographic market . Pay is based on a number of factors… more
- Power Device Corp (Bohemia, NY)
- …switching power control, driver, and filter circuits, that are implemented using chip & wire hybrid, or SMT-CCA construction. Key Responsibilities: + Tot ake ... for : product cost, performance, feature set, time to market , and technical risk. + Follow a defined design...schedules ; identify the resources required to get from market requirement to product release. Identify risks and develop… more
- The Conference Board (New York, NY)
- …policy, crypto, money, banking, and financial stability. + Partner with labor market institute to generate US labor market forecasts including unemployment ... on US fiscal policy. + Disseminate the US forecast to external surveys (Blue Chip , Bloomberg, etc.). + Present US themes on the monthly Economy Watch webcast series… more