• Postdoctoral Fellow, Basic Science & Transition…

    UTMB Health (Galveston, TX)
    …in cell and extracellular vesicle biology approaches. Knowledge of organ on a chip and organoids are preferred . SALARY: Commensurate with experience **Equal ... exosomes impact on feto-maternal units will be studied using intrauterine organ on chip devices or organoids. In addition, the Postdoctoral Fellow will be involved… more
    UTMB Health (07/04/25)
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  • Product Test Engineer - Machine Learning Hardware,…

    Amazon (Austin, TX)
    …Linux-based systems and scripting * Understanding of computer architecture and system-on- chip (SoC) designs Preferred Qualifications Preferred ... Amazon values diverse experiences. Even if you do not meet all of the preferred qualifications and skills listed in the job description, we encourage candidates to… more
    Amazon (06/24/25)
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  • Packaging Engineer

    Texas Instruments (Dallas, TX)
    …new material development and electrical/thermal/mechanical modeling to support development ** Preferred qualifications:** + Experience developing new Flip Chip ... are a must! As a member of our Flip Chip packaging team, you'll have the chance to interact...**Responsibilities may include:** + Develop new requirements for Flip Chip CSP (FCCSP) packaging and bump process development and… more
    Texas Instruments (07/19/25)
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  • Silicon Architect, Reality Labs

    Meta (Austin, TX)
    …design, logic simulation, and performance analysis ** Preferred Qualifications:** Preferred Qualifications: 10. Experience architecting or designing chip ... multiple clock and voltage domains for battery-operated systems 11. Experience deploying chip pervasive logic such as clock generation, reset, and power management… more
    Meta (07/23/25)
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  • Systems Validation Manager, Annapurna Labs

    Amazon (Austin, TX)
    …the complete vertical stack of Silicon, PCB, High Speed components eg, HBM, PCIe and Chip to Chip , inter-systems and system to system. Diving deep into new ... responsibilities As a Validation manager, you are responsible for validating the chip and system architecture for the next generation Machine Learning Acceleration… more
    Amazon (07/22/25)
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  • Principal IC Packaging Engineer, Silicon…

    SpaceX (Bastrop, TX)
    …processes including material characterization and down-selection for wafer-level and chip -level systems + Develop new technologies and establish baselines for ... assembly and packaging including SMT, flip chip , bonding, molding, underfill, dispense, EMI shielding, lid, and solder ball attach + Bring-up for new product… more
    SpaceX (07/15/25)
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  • Sr. IC Packaging Engineer, Silicon Technology…

    SpaceX (Bastrop, TX)
    …to mass production including equipment and material selection for wafer-level and chip -level systems + Develop new technologies and establish baselines for assembly ... wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip , bonding, molding, underfill, dispense, sputter, lid attach, and solder ball… more
    SpaceX (07/15/25)
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  • Sr Systems Validation Manager, Annapurna Labs

    Amazon (Austin, TX)
    …the complete vertical stack of Silicon, PCB, High Speed components eg, HBM, PCIe and Chip to Chip , inter-systems and system to system. Diving deep into new ... responsibilities As a Validation manager, you are responsible for validating the chip and system architecture for the next generation Machine Learning Acceleration… more
    Amazon (06/27/25)
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  • Electrical Engineer - Summer Intern (May '26- Aug…

    Skyworks (Austin, TX)
    …Intern - 2026. The systems projects span new product definition, new chip bring-up, validation, creating FPGA IPs for our next-generation product reference designs, ... co-developing solutions for IEEE-1588, PCIe applications, and modeling important chip performance parameters like cross-talk, signal integrity, package thermal… more
    Skyworks (08/27/25)
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  • Package Design Engineer

    Broadcom (Austin, TX)
    …is seeking an experienced IC package-design engineer for complex flip- chip -BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power ... track your work across 2+ projects simultaneously + General flip- chip BGA package design & engineering + Project management...designs + Cadence APD (allegro package designer) experience is preferred . Equivalent tool is OK. + Cooperate with our… more
    Broadcom (08/19/25)
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