• Sr Manager, Advanced Packaging

    Micron Technology, Inc. (Boise, ID)
    …to Advance Packaging and collaborating with engineers in CMP, WET, ETCH, PHOTO, CVD , Bonding, debonding, Wafer prep, Hybrid bonding, TCB & pre/post encap departments ... to ensure high yield and quality standards are met. + Work with multi-functional team for a successful process/equipment/material development, CIP, and on other key strategic projects & programs implementation. + Own the selection, installation, and… more
    Micron Technology, Inc. (08/13/25)
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