• IC Package Engineer (Starlink/Akoustis)

    SpaceX (Bastrop, TX)
    …Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation + Conduct and ... cycling, uHAST, HTS, vibration) + Knowledge of assembly processes: SMT, die attach, reflow soldering, encapsulation, underfill, etc. + Strong analytical skills… more
    SpaceX (01/01/26)
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  • Feeder Packer

    WestRock Company (Greenville, TX)
    GENERAL PURPOSE: Feed die cut blanks into folder gluer. Pack folding cartons into corrugated cases to fill orders. ESSENTIAL JOB FUNCTIONS: * Performs visual ... inspection of cartons for printing, die -cutting and gluing defects while feeding and packing cartons. * Along with Quality department, verifies case count. *… more
    WestRock Company (12/22/25)
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  • Equipment Engineer (Bonding)

    Insight Global (Austin, TX)
    …semiconductor industry Proficient with bonding tools Experience with pick-and-place, die -to-wafer bonding, or wafer-to-wafer bonding for ultra-small or small size ... die . Experience working in a fab/ cleanroom environment Bachelor's degree in materials science, chemical engineering, electrical engineering, mechanical engineering,… more
    Insight Global (12/19/25)
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  • Materials Engineer, Metal Casting (Starlink)

    SpaceX (Bastrop, TX)
    …and businesses around the globe. As a member of the Starlink High Pressure Die Casting Materials team at our Bastrop facility, you will own solving complex materials ... engineering discipline + Experience with metal casting technologies (high pressure die casting, low pressure, sand, permanent mold) + Experience in metallographic… more
    SpaceX (12/16/25)
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  • Principal HBM Design Architect

    Micron Technology, Inc. (Richardson, TX)
    …be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and control logic, ... include, but are not limited to:** + Responsible for the high-speed DRAM and Base die interface in HBM cube. + Design the DRAM command and control logic, as well… more
    Micron Technology, Inc. (12/15/25)
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  • Cutting Operator

    Cartamundi (Dallas, TX)
    …up, operating, and maintaining various cutting machines; including the Polar Cutter, Die Cutter, Rollem Slipstream, Saturn machine, and partial list of machines- to ... operate the following machines: Polar Cutter - for precision cutting of paper stacks, Die Cutter - for custom shape and form cutting. Rollem Slipstream - for… more
    Cartamundi (12/05/25)
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  • Production Design Engineer

    Cartamundi (Dallas, TX)
    …standards and ensure manufacturability. + Drive cost-effective tooling strategies, including die purchasing decisions, to meet both quality and budgetary goals. + ... software and production documentation tools. + Strong understanding of tooling, die design, and material optimization. + Excellent problem-solving skills and ability… more
    Cartamundi (12/05/25)
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  • Optical Packaging Engineer

    Texas Instruments (Dallas, TX)
    …semiconductor chips.** + **Experience in semiconductor packaging technology, including die attach, wire bonding, flip-chip, and micro-optics.** + **Strong ... characterization and probing.** + **Experience with automated test setups for wafer/ die scale electro-optical measurements through Python or any other language and… more
    Texas Instruments (12/01/25)
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  • Signal/Power Integrity Eng, Annapurna Labs

    Amazon (Austin, TX)
    …packaging technologies, PCB design, and power delivery systems. Additional experience with die capacitors, SOC power, and 3D/2.5D EMIR simulation tools would be ... and parallel bus interfaces. Preferred Qualifications - MS in EE - Experience with die capacitors, DTC caps and IPD caps - Experience with SOC power, integrated… more
    Amazon (11/23/25)
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  • Principal Design Engineer, ASIC

    Micron Technology, Inc. (Richardson, TX)
    …controllers, memory interfaces (eg, DDR, LPDDR, ONFI, UCIe, PCIe, NVMe), and die -to- die communications modules. + Lead architecture reviews, contribute to design ... specifications, and guide RTL and verification teams. + Stay current with memory and storage standards, interconnect protocols, and emerging technologies. **Required Qualifications:** + Bachelor's or Master's degree in Electrical Engineering, Computer… more
    Micron Technology, Inc. (10/25/25)
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