• Principal Thermal Mechanical Photonic Designer

    NVIDIA (Santa Clara, CA)
    …gaming consoles and self-driving cars. Come join us in our mission to Engineer the next generation of outstanding products. Teams are dedicated to the architecture ... and laser performance under different stress conditions. + Modeling Si die -package thermo-mechanical interactions + Solder joint fatigue and creep modeling +… more
    NVIDIA (07/13/25)
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  • Engineering Technician -Temporary (Night…

    Skyworks (Irvine, CA)
    …with assembly equipment such as: solder screen printing, SMT placement machines, die attach equipment, Gold Wire Ball Bonders, compression auto mold, laser marking, ... Market:Irvine CaliforniaNearest Secondary Market:Los Angeles Job Segment: Night, Mechanical Engineer , Maintenance, Engineer , Network, Operations, Engineering, Manufacturing,… more
    Skyworks (07/23/25)
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  • Senior VLSI Design Engineering (New College Grad,…

    SanDisk (Milpitas, CA)
    …NAND flash, including new, most advanced 3-dimentional NAND memories. A design engineer will focus on developing technologies related to AI. In this role, ... role offers the opportunity to define chip architecture, floorplan and die size by cross-collaborating with multiple functions including layout, characterization,… more
    SanDisk (07/19/25)
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  • Senior Director, Engineering

    Skyworks (Newbury Park, CA)
    …are documented, communicated, executed and validated at product test + Ensure robust die -probe plans are defined early and executed with a determined timeline + Lead ... ###@skyworksinc.com. Nearest Major Market:VenturaNearest Secondary Market:Oxnard Job Segment: RF Engineer , Electrical Engineering, Front End, Test Engineer ,… more
    Skyworks (07/06/25)
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  • Advanced Packaging Modeling Expert

    Applied Materials (Santa Clara, CA)
    …**About the Role** We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team. This is a critical role focused ... and mechanical loads. + Familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, and reflow. + Excellent analytical,… more
    Applied Materials (08/14/25)
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