- Northrop Grumman (Linthicum Heights, MD)
- …packaging for aerospace/defense programs. + Demonstrated leadership in advancing packaging capabilities and mentoring engineering talent. Primary Level Salary ... **You'll Get To:** Bring your comprehensive understanding of semiconductor die packaging -from wafer preparation through hermetic sealing and final delivery. Drive… more
- Northrop Grumman (Linthicum Heights, MD)
- …packaging for aerospace/defense programs. + Demonstrated leadership in advancing packaging capabilities and mentoring engineering talent. Primary Level Salary ... Engineer** based out of Linthicum, MD to lead advanced packaging and microelectronics assembly initiatives for high-reliability, mission-critical systems. Advanced… more
- Northrop Grumman (Linthicum Heights, MD)
- … Engineering . + 5+ years of experience in semiconductor packaging , assembly, or microelectronics manufacturing. + Experience developing manufacturing work ... die-level inspection, pick-and-place assembly, tape-and-reel operations, and final product packaging . You will respond to design and specification changes, capture… more
- Northrop Grumman (Baltimore, MD)
- …Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies + Collaboration within a cross-functional Integrated Product Team ... with peers in adjacent functions, including electrical design, systems engineering , thermal analysis, structural analysis, drafting, supply chain management and… more
- Northrop Grumman (Jessup, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Junction, MD. **Basic Qualifications:** + Bachelor Degree in Electrical Engineering or comparable STEM degree and a minimum of...in working with EM tools for modeling for RF packaging effects (CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)… more
- Northrop Grumman (Linthicum Heights, MD)
- …will be enrolled full time in Fall 2026 + Be majoring in Electrical Engineering , Microelectronic Engineering , Computer Engineering , Quantum Science, or other ... in working with EM tools for modeling for RF packaging effects (CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)...share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives.… more
- Northrop Grumman (Jessup, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... the Agile methodology of software development. Work closely with systems engineering team to define software centric architecture and requirements. Active leadership… more
- Northrop Grumman (Jessup, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging and delivering discriminating microelectronics to the military, aerospace, and commercial ... with unique "More than Moore" solutions. https://www.northropgrumman.com/what-we-do/microelectronics The Systems Engineering Integration & Test (SEIT) department is seeking **Principal/Sr.… more
- Northrop Grumman (Jessup, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... FPGA, digital, and analog hardware engineers utilizing your knowledge of systems engineering methods, tools and techniques + Follow product development from design… more
- Northrop Grumman (Linthicum Heights, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... MD or Annapolis Junction, MD. **Basic Qualifications:** + Bachelor Degree in Electrical Engineering or comparable STEM degree with 2 years of relevant engineering… more