• Lead Application Engineer

    Cadence Design Systems, Inc. (Austin, TX)
    …IP placement, TSV placement and power-grid planning & design + 3D Stacking & Packaging : Generate 3D stacking, hybrid bonding pad and u-bump map + Design Flow ... the technologies that modern life depends on. We are a global electronic design automation company, providing software, hardware, and intellectual property to design… more
    Cadence Design Systems, Inc. (07/10/25)
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  • GaN Device Project leader

    Texas Instruments (Dallas, TX)
    …Physics, or related degree + 5+ years of experience in GaN-based electronic device development + Familiarity with GaN-on-Si technology for power switching ... and data analysis skills. + Knowledge of device physics, reliability mechanisms, and packaging interaction is a plus. + Ability to work in teams and collaborate… more
    Texas Instruments (07/08/25)
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  • Engineering and Production Bench Technician

    Futurex (Bulverde, TX)
    …will have general knowledge of the principles, practices, and techniques of electronic hardware repair and maintenance. The qualified candidate should possess the ... electrostatic discharge (ESD) precautions + Prepare shipments following approved packaging guidelines Requirements + Associate degree in electronics or related… more
    Futurex (06/09/25)
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