- Celestica (Richardson, TX)
- …culture. **Responsibilities:** + Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until ... operation of heat transfer hardware. + Consider the thermal aspects of chip packaging technologies. + Apply best-in-class fluid flow geometry and technology to cool… more
- Texas Instruments (Dallas, TX)
- …Physics, or a related field + 5+ years of experience in GaN-based electronic device development, preferably in a leadership role + Familiarity with GaN-on-Si ... communication and data analysis skills + Knowledge of device physics, reliability mechanisms, and packaging interaction is a plus + Ability to lead and work in teams… more
- Cadence Design Systems, Inc. (Austin, TX)
- …IP placement, TSV placement and power-grid planning & design + 3D Stacking & Packaging : Generate 3D stacking, hybrid bonding pad and u-bump map + Design Flow ... the technologies that modern life depends on. We are a global electronic design automation company, providing software, hardware, and intellectual property to design… more
- Texas Instruments (Dallas, TX)
- …Physics, or related degree + 5+ years of experience in GaN-based electronic device development + Familiarity with GaN-on-Si technology for power switching ... and data analysis skills. + Knowledge of device physics, reliability mechanisms, and packaging interaction is a plus. + Ability to work in teams and collaborate… more