• Mechanical Engineer III

    Textron (Wilmington, MA)
    **Mechanical Engineer III ** **Description** **_Who We Are_** Textron Systems is part of Textron, a $14 billion, multi\-industry company employing 35,000 talented ... and systems subjected to extreme hypersonic flight conditions\. The activities include packaging design of electronics systems and interconnects, the development… more
    Textron (08/07/25)
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  • Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS electronics , semiconductor diode lasers and amplifiers, superconducting electronics ... characterization, fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging , and testing of electronic and photonic circuits. These… more
    MIT Lincoln Laboratory (08/08/25)
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  • Integrated Circuit (IC) Layout and Mask Design…

    MIT Lincoln Laboratory (Lexington, MA)
    …imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS electronics , semiconductor diode lasers and amplifiers, superconducting electronics ... characterization, fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging , and testing of electronic and photonic circuits. These… more
    MIT Lincoln Laboratory (05/29/25)
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