• Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …(CSL): Facilities housing III-V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic chemical vapor deposition (MOCVD), diamond chemical vapor ... deposition (CVD)) and fabrication * Microsystems Integration Facility (MIF): Packaging and integration facilities for wire-bonding, vacuum-reflow soldering, flip-chip hybrid integration Job Description The candidate will work as a member of a… more
    MIT Lincoln Laboratory (08/08/25)
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  • Integrated Circuit (IC) Layout and Mask Design…

    MIT Lincoln Laboratory (Lexington, MA)
    …(CSL): Facilities housing III-V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic chemical vapor deposition (MOCVD), diamond chemical vapor ... deposition (CVD)) and fabrication * Microsystems Integration Facility (MIF): Packaging and integration facilities for wire-bonding, vacuum-reflow soldering, flip-chip hybrid integration Job Description The candidate will work as a member of a… more
    MIT Lincoln Laboratory (05/29/25)
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