• FIB Technician - (3rd Shift)

    Applied Materials (Santa Clara, CA)
    …+ Understand the basic principles of scanning electron microscopy ( SEM ), focused ion beam ( FIB ), and transmission electron microscopy ... Prepare transmission electron microscope (TEM) lamella samples using focused ion beam ( FIB ), optimize sample preparation procedures and… more
    Applied Materials (08/07/25)
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  • Metrology Technician III (T3)

    Applied Materials (Santa Clara, CA)
    …after training. + Understand basic scanning electron microscopy ( SEM )/ Focused Ion Beam ( FIB )/Transmission electron microscopy (TEM) ... of process system + Prepare cross section samples for scanning electron microscope ( SEM...electron microscope (TEM) lamella samples by focused ion beam ( FIB… more
    Applied Materials (09/04/25)
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  • FIB Engineer III - E3

    Applied Materials (Santa Clara, CA)
    …others on advanced use of instrumentation **Qualifications** + Expertise in operation of Dual Beam FIB instruments + Expertise in TEM sample preparation using DB ... of automation recipes (AutoTEM/iFast) + 4+ years experience on FIB / SEM tool + Advanced understanding of semiconductor...Experience with Atom Probe Tomography + Experience with Plasma FIB systems + Familiarity with Electron Microscopic… more
    Applied Materials (09/04/25)
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  • Process Engineer

    Applied Materials (Santa Clara, CA)
    …preparation and experience with create/modify automation recipe(AutoTEM/iFast). + 4+ years' experience on FIB / SEM tool operation (Ga- FIB and Plasma FIB ). ... FIB Engineer who has experience operating and resolving various projects using FIB / SEM . In this role, the individual will be responsible for + Interactive… more
    Applied Materials (08/26/25)
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  • Wafer Fab Process Engineer

    Teledyne (Goleta, CA)
    …tools and associated modules in the area. Candidate will characterize wafers and devices using SEM and or FIB / SEM . As part of process development, hands-on ... is helpful) + * Ability to use inspection equipment (microscopes, FIB / SEM , interferometers), semiconductor fabrication equipment, and wet bench chemistry… more
    Teledyne (08/16/25)
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  • Process Development Engineer

    Teledyne (Goleta, CA)
    …to process early production wafer lots. Candidate will characterize wafers and devices using SEM and or FIB / SEM . As part of process development, hands-on ... equivalent is helpful) + Ability to use inspection equipment (microscopes, FIB / SEM , interferometers), semiconductor fabrication equipment, and wet bench… more
    Teledyne (07/22/25)
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  • Sr. Process Development & Integration Engineer

    Teledyne (Goleta, CA)
    …w/ optical microscopy, surface profiling (interferometry, AFM, etc), ellipsometry, sheet resistance, SEM / FIB , SIMS/XPS, and film stress. + Experience using MES ... systems in a medium volume, high mix, semiconductor manufacturing environment. + Demonstrated understanding of material/chemical safety data and ability to follow safety protocols & regulations. + Experience w/ phase gate release methodologies (NPI, phased… more
    Teledyne (09/06/25)
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  • Material Characterization and Failure Analysis…

    Google (Fremont, CA)
    …or equivalent practical experience. + 4 years of experience operating and interpreting data from FIB / SEM and STEM to drive root cause analysis. + 4 years of ... experience in a research setting or industry. **Preferred qualifications:** + MSc, or PhD degree in Materials Science, Electrical Engineering, Physics, or a related field. + 3 years of industry experience in material characterization/failure analysis of… more
    Google (08/30/25)
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  • Process Engineer

    Teledyne (Goleta, CA)
    …w/ optical microscopy, surface profiling (interferometry, AFM, or similar), ellipsometry, , SEM / FIB , SIMS/XPS, and film stress. + Develop new or improve ... coordinates and directs engineering, sustaining, and continuous improvement activities focused on photolithography and process integration. Defines processing or… more
    Teledyne (08/21/25)
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  • Yield and Integration Engineer

    Teledyne (Goleta, CA)
    …8D, 6-sigma, etc.) + Design of Experiments (DOE/ANOVA) + Optical microscopy + SEM / FIB + Profilometry, ellipsometry, X-Section, wafer stress + Other elemental ... analysis methods (TOF-SIMS, EDX, & Auger) + Other fault isolation techniques (FIBedit, OBIRCH/TIVA, IR, & curve trace) _Other desired experience/knowledge areas:_ + _Wafer processing (photo, etch, dep, clean, CMP, inspection, etc.)_ + _Vacuum technology and… more
    Teledyne (08/15/25)
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