- Micron Technology, Inc. (Boise, ID)
- …is searching for its next Product Pathfinding Engineer on the High Bandwidth Memory ( HBM ) technology team! In this role, you will be tasked with the development of ... JEDEC- HBM or alternative Near Memory DRAM solutions! Additionally, you...the implementation of innovative 2.5D and 3D solutions, including HBM , from an electrical and packaging standpoint. Product Engineers… more
- Micron Technology, Inc. (Boise, ID)
- …and drive the materials roadmap for Mircon's advanced 3D memory products including HBM and 3DS DRAM. You will collaborate with Micron's multi-functional team that ... includes process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving materials suppliers to meet roadmap needs, leading… more