• Principal Application Engineer

    Henkel (Irvine, CA)
    Principal Application Engineer _ Semiconductor Advanced Package **_About_** **_this_** **_position_** At Henkel, you'll be part of an organization that's shaping the ... and make an impact at Henkel. **What you'll do** + Technical service engineer who provides technical engineering support for Henkel's Advanced Packaging Material… more
    Henkel (11/13/25)
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  • Engineer RF Microwave Design

    Northrop Grumman (Mcclellan, CA)
    …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... subsystems, and large-scale high-performance computing systems. MDA is seeking a ** Engineer RF Microwave Design** with demonstrated ability to support our innovative… more
    Northrop Grumman (10/04/25)
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  • Process Engineer

    Fujifilm (Santa Clara, CA)
    …of many applications such as commercial printing, graphics, label & packaging , additive manufacturing, ceramic tiles, textiles, electronics and life ... Tokyo with over 70,000 employees across four key business segments of healthcare, electronics , business innovation, and imaging. We are guided and united by our… more
    Fujifilm (11/25/25)
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  • Systems Integration Engineer

    Meta (Fremont, CA)
    …data visualization, System Architecture and Integration) using Python 18. Electronics Packaging : domain knowledge of semiconductor manufacturing industry ... Master's degree (or foreign equivalent) in Industrial and Systems Engineering, Mechanical Engineering, Optical Engineering, Physics, Electronics , or a related… more
    Meta (10/11/25)
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  • Process Engineer , Senior Manager (PVD)

    Applied Materials (Santa Clara, CA)
    …of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - ... . We are seeking an experienced **Senior Manager** to lead our **Advanced Packaging Physical Vapor Deposition (PVD) process team** . The ideal candidate will have… more
    Applied Materials (10/11/25)
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  • Principal Optical Engineer

    Oracle (Sacramento, CA)
    …printed circuit boards or integrated circuits; mechanical design of electronics enclosures or integrated circuit packaging ; and embedded software/firmware ... **Job Description** The Principal Optical Engineer will be joining the Optical Network Engineering team which is responsible for building and scaling Oracle's… more
    Oracle (12/01/25)
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  • Product Design Engineer , Platforms

    Google (Sunnyvale, CA)
    …a related field, or equivalent practical experience. + 3 years of experience in electronics packaging , server systems, data centers, or a related industry. + 3 ... Product Design Engineer , Platforms _corporate_fare_ Google _place_ Sunnyvale, CA, USA...structural modeling techniques. **Preferred qualifications:** + Master's degree in Mechanical Engineering, Product Design, or a related field, or… more
    Google (11/20/25)
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  • Facilities Engineer

    Fujifilm (Santa Clara, CA)
    …of many applications such as commercial printing, graphics, label & packaging , additive manufacturing, ceramic tiles, textiles, electronics and life ... **Position Overview** The Facilities Engineer IV plans facilities changes for plant, office,...70,000 employees across four key business segments of healthcare, electronics , business innovation, and imaging. We are guided and… more
    Fujifilm (10/14/25)
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  • Principal Optical Engineer of Optics…

    Oracle (Sacramento, CA)
    …printed circuit boards or integrated circuits; mechanical design of electronics enclosures or integrated circuit packaging ; and embedded software/firmware ... technical leadership for designing, developing, modifying and evaluating electronic, electro- mechanical or mechanical components, assemblies or integrated… more
    Oracle (11/25/25)
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  • Senior Staff Thermal Design Engineer

    Celestica (San Jose, CA)
    …City: San Jose **Summary** Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, and accelerators. We ... operation of heat transfer hardware. + Consider the thermal aspects of chip packaging technologies. + Apply best-in-class fluid flow geometry and technology to cool… more
    Celestica (12/06/25)
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