• Lead PCB Designer

    Actalent (Seattle, WA)
    …payloads and phased-array antenna modules. + Collaborate with the Responsible Engineer to define and maintain board-level architecture, layer stack-ups, and routing ... fabrication, assembly, and bring-up support. + Integrate board design within mechanical , RF, thermal, and system-level constraints, ensuring mechanical … more
    Actalent (12/20/25)
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  • Lead PCB Designer

    Actalent (Seattle, WA)
    …payloads and phased-array antenna modules. + Collaborate with the Responsible Engineer to define and maintain board-level architecture, layer stack-ups, and routing ... fabrication, assembly, and bring-up support. + Integrate board design within mechanical , RF, thermal, and system-level constraints, ensuring mechanical … more
    Actalent (12/20/25)
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  • Hardware Developer 4

    Oracle (Olympia, WA)
    …specifications and requirements for direct-to-chip cooling solutions. + Oversee the qualification, integration , and mass production of liquid cooling systems at ... **Job Description** We are seeking a skilled engineer or scientist to lead the deployment and...Serve as the technical lead for direct-to-chip liquid cooling systems with a focus on collaboration across external manufacturers… more
    Oracle (11/25/25)
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