• Manager of Packaging Assembly Integration

    Global Foundries (Malta, NY)
    …fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect ... solutions including Copper RX, Copper uPillar , chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. Responsibilities: + Drives high engagement and trust within their team and between teams to deliver beyond expectations. + Delivers results… more
    Global Foundries (07/24/25)
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  • Photonics Integration Engineer

    NY CREATES (Albany, NY)
    …wafer fabrication facility. + Process Integration experience non-CMOS technologies ( MEMS , sensors, magnetics, photonics, etc.) + Experience with 2.5D/3D integration ... and/or heterogeneous integration. + Background in modeling or device physics of photonic devices, specifically silicon or III-V photonics + Familiarity with IC layout and verification tools (KLayout, Cadence, Mentor Graphics, Synopsys) + Demonstrated hands-on… more
    NY CREATES (07/19/25)
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