• Hardware Developer Engineer, AWS CQC- Fab

    Amazon (Pasadena, CA)
    …in two or more of the following device fabrication areas: MEMS, metal /dielectric thin film etching, metal /dielectric thin film deposition, epitaxy, process ... integration, and electron / ion / x-ray / scanning probe - Basic programming skills (eg Python, Julia, MATLAB) - Great problem solving and analytical skills - Communication and data presentation skills - Effective working in a team environment with other… more
    Amazon (06/13/25)
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  • RP4879:Composites Fab & Assembler Sr. Swing…

    Lockheed Martin (Palmdale, CA)
    …assemblies by determining proper placement, and laying up composite, plastic and metal parts and adhesives onto tools or molds\. Prepares parts for bagging, ... including placement of bleeders, thermocouples, probes and vacuum connections, checks seals on completed bagged parts for leaks\. Sets up assemblies and parts in various types of processing and curing equipment such as an autoclave, oven or platen press in… more
    Lockheed Martin (07/12/25)
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  • Process Engineer

    Fujifilm (Santa Clara, CA)
    …and evaluation criteria for obtaining results. Communicates well with other fab personnel and in meetings with other sites. **Supervision:** Determines methods ... that are necessary to achieve performance and cost requirements. + Troubleshoot fab processes and correct problems in MEMS devices using experimental methods such… more
    Fujifilm (05/29/25)
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  • Test System Design Engineer 4 (ATS Irvine)

    Astronics (Irvine, CA)
    …Interference (EMI) requirements. + Must be able to read and understand assembly drawings, FAB drawings, indented BOMs and parts lists. + Good knowledge of metals and ... alloys and their properties and sheet metal design + 7+ years of hands on engineering design experience **Computer Skills:** + LabVIEW, Test Stand, LabWindows CVI,… more
    Astronics (07/18/25)
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