• Microelectronics Technician - 2nd shift

    SpaceX (Redmond, WA)
    …selection, plasma recipes, bondline thickness, and wirebond integrity + Perform process verification by measuring epoxy void, wirebond loop height, and pull/shear ... force on die/wirebond using various metrology instruments such as CSAM, Xray, 3D profilometer, pull/shear...such as machine, design, and tooling changes + Initiate process improvements and collaborate with equipment and tooling suppliers… more
    SpaceX (11/15/25)
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