• Signal/Power Integrity Eng, Annapurna Labs

    Amazon (Austin, TX)
    …like Hspice, Cadence, and HFSS. The role involves working with advanced packaging technologies, PCB design , and power delivery systems. Additional experience ... who will play a key role in the definition, design and validation of AWS next generation machine learning...will have a meaningful opportunity to participate in the design and execution of all SI related topics, with… more
    Amazon (08/25/25)
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  • Account Technical Executive, Custom Analog

    Cadence Design Systems, Inc. (Austin, TX)
    …relevant to the customer ecosystem including heterogeneous integration and advanced packaging + Understanding of emerging design practices including model-based ... industry knowledge to maximize and monetize the value of Cadence System Design solutions. Working in concert with a strategic account focused sales executives,… more
    Cadence Design Systems, Inc. (08/08/25)
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  • HBM PHY Expert, Annapurna Labs

    Amazon (Austin, TX)
    …DDR/HBM training, timing parameters and/or controller features -Drive the IP Integration and design of silicon and 2.5D packaging -Support the physical design ... an HBM/DDRx Phy expert with role in the definition, design and validation of AWS next generation ML Chips,...the outstanding and meaningful opportunity to participate in the design and execution of all HBM, Memories and Serdes… more
    Amazon (08/13/25)
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  • Sr. HBM PHY Expert, Annapurna Labs

    Amazon (Austin, TX)
    …DDR/HBM training, timing parameters and/or controller features - Drive the IP Integration and design of silicon and 2.5D packaging - Support the physical ... an HBM/DDRx Phy expert with role in the definition, design and validation of AWS next generation ML Chips,...the outstanding and meaningful opportunity to participate in the design and execution of all HBM, Memories and Serdes… more
    Amazon (06/06/25)
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  • Desktop Engineer W/ Tanium

    TEKsystems (Irving, TX)
    …build. The resource is responsible for the Office Professional Plus client design , build process, packaging methodology, deployment and update mechanisms. The ... Call With Manager: Notes: She now will own server packaging for MS Office 1 week out of every...etc. * Take a leadership role in shaping service design direction * Partner and mentor with other engineers… more
    TEKsystems (08/30/25)
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  • Tanium Patch Coordinator

    TEKsystems (Irving, TX)
    …This position will be responsible for Office 365 Professional Plus client design , build process, packaging methodology, deployment and update mechanisms. The ... Top Skills Details Admin Studio, Wise, Active directory, Tanium, Powershell, packaging Additional Skills & Qualifications * Responsible for engineering the M365… more
    TEKsystems (08/29/25)
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  • 3DIC Lead Application Engineer

    Cadence Design Systems, Inc. (Austin, TX)
    … partitioning, floor planning, IP placement, TSV placement and power-grid planning & design + 3D Stacking & Packaging : Generate 3D stacking, hybrid bonding ... performing team at Cadence this person will be responsible for guiding the design implementation solutions and flow development of 3DIC for various top semiconductor… more
    Cadence Design Systems, Inc. (07/10/25)
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  • Systems Design /Architecture Engineer

    Teledyne (Garland, TX)
    …factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration ... excitement of being on a team that wins. **Job Description** Systems Design /Architecture Engineer: Designs a complete and complex framework, system or product.… more
    Teledyne (07/04/25)
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  • Biomedical Systems/Applications Engineer

    Texas Instruments (Dallas, TX)
    …resolution to customer problems by interfacing across different functional groups such as design , product, test, packaging , marketing and sales + Assist with ... in every aspect of the IP development including system definition, design , simulations, prototyping, bench evaluation, transfer to production, and customer visits.… more
    Texas Instruments (07/08/25)
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  • HBM Design Architect

    Micron Technology, Inc. (Richardson, TX)
    …and 3D packaging technologies + Extensive experience with CMOS circuit design and good understanding of semiconductor device physics + Familiarity with DRAM ... inspiring the world to learn, communicate and advance faster than ever. An HBM Design Architect will be responsible for the design & development of next… more
    Micron Technology, Inc. (08/13/25)
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