• Opto-Mechanical Engineer

    Vector Atomic (Pleasanton, CA)
    …optical/optomechanical system design ; simulations and prototyping to support design + Micro-optical assembly and packaging for environmental robustness ... techniques using active alignment tools + Automated assembly and characterization; design for manufacturability + Narrow linewidth lasers (Diodes, DPSS, Fiber… more
    Vector Atomic (11/21/25)
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  • Manufacturing Systems Engineer II

    Fujifilm (Santa Clara, CA)
    …meet business requirements. Participates in cross-functional linked teams to design , architect and implement MES based solutions.. **Knowledge:** Developing ... their printheads. We are a recognized leader in the manufacturing and design of durable and productive drop-on-demand inkjet printheads that power cutting-edge… more
    Fujifilm (12/16/25)
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  • PCB Layout Engineer , SSD Hardware…

    SanDisk (Irvine, CA)
    …on DFM's and Fabrication questions + Investigate and brainstorm on best-in-class design methodologies - materials, process, and tools + Board complexities include ... library experience is a plus SKILLS: + Flexibility and creativity in solving packaging and routing challenges + Valuable contributing team member to work with other… more
    SanDisk (01/03/26)
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  • Manufacturing Systems Engineer I

    Fujifilm (Santa Clara, CA)
    …their printheads. We are a recognized leader in the manufacturing and design of durable and productive drop-on-demand inkjet printheads that power cutting-edge ... of many applications such as commercial printing, graphics, label & packaging , additive manufacturing, ceramic tiles, textiles, electronics and life science… more
    Fujifilm (12/16/25)
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  • Intern 2026: Software Engineer

    IBM (San Jose, CA)
    …software engineerng and computational skills towards state-of-the-art chip architecture, design , fabrication and advanced chip packaging . Background knowledge ... of computer science, data science, machine learning or other computational techniques are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions. **Required technical and professional… more
    IBM (12/11/25)
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  • Senior Deep Learning Frameworks Sustaining…

    NVIDIA (Santa Clara, CA)
    …relevant software development experience + Excellent C/C++ programming and software design skills, including debugging and open source integration. Python experience ... helpful. + Utilizing tools involved in building software (Make, Docker, Bazel), packaging systems (Debian, pip, npm, etc.), Build Systems (Gitlab, CI/Jenkins). +… more
    NVIDIA (12/03/25)
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  • R&D Engineer Hardware 4

    Broadcom (Irvine, CA)
    …electronic parts, components, integrated circuitry, mechanical systems, equipment and packaging , optical systems and/or DSP systems. - Knowledge: Having wide-ranging ... in creative and effective ways. * Strong project management skills * Leads design and delivery of new products/process * Functional breadth and depth, plus expert… more
    Broadcom (12/03/25)
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  • RF & Microwave Design Engineering Manager

    Teledyne (Mountain View, CA)
    …world's most advanced MW/RF capabilities for current and emerging challenges. The RF & Microwave Design Engineer Manager will: + Lead an RF & Microwave Design ... factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration… more
    Teledyne (12/31/25)
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  • IC / Semiconductor Package Designer

    Broadcom (Irvine, CA)
    …**Role Overview** We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design , and productization using ... technology + Proficiency in Cadence Allegro APD/SIP or comparable packaging design tools. + Experience working with global OSATs and substrate suppliers.… more
    Broadcom (12/02/25)
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  • Senior Custom ASIC Engineering Lead

    Broadcom (Irvine, CA)
    … capable of leading external and internal cross-functional teams in areas such as physical design , STA, DFT, and packaging ? Have you taped out so many chips that ... programs from inception to finish, including RFQs, technology and IP collaterals, design , test, packaging , fabrication, bring-up and production + Advise… more
    Broadcom (11/06/25)
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