• PCB Layout Engineer , SSD Hardware…

    SanDisk (Irvine, CA)
    …library experience is a plus SKILLS: + Flexibility and creativity in solving packaging and routing challenges + Valuable contributing team member to work with other ... advanced team members + Proficiency in Cadence Allegro PCB Layout tool with 5+ years' experience **Additional Information** Sandisk is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or… more
    SanDisk (01/03/26)
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  • Analog/mixed-signal IC Design Engineer

    Cisco (San Jose, CA)
    …methodology from conception to production. * You will also collaborate with packaging and hardware design team to ensure signal and power integrity specifications ... are met. * You will develop high speed AMS circuits and best-in-class products that push the boundaries of what is possible. **Minimum qualifications:** * BSEE degree with 8+ years of experience or equivalent or an MS degree with 6+ years of experience, or… more
    Cisco (12/24/25)
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  • Mechanical Design Engineer Sr - Skunkworks

    Lockheed Martin (Palmdale, CA)
    …Skills:** \- Experience with mechanical design of Electromagnetic/RF components, electrical packaging , power system layout, and circuit board design\. \- General ... knowledge in fundamental EM theories \- Experience in design for additive manufacturing \- Experience managing various programmatics of projects \(schedule, costs, procurement activity\) **Security Clearance Statement:** This position requires a government… more
    Lockheed Martin (12/24/25)
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  • ASIC Design Verification Engineer I (Full…

    Cisco (San Francisco, CA)
    …and custom library development, physical design, DFT, signal integrity, and advanced packaging . Work with the latest VLSI techniques and deep submicron technologies, ... owning projects from concept to in-house physical implementation. **Minimum Qualifications** ** ** + Completion within the past 3 years, or current enrollment with expected completion within 12 months, of a Bachelor's degreeprogram.Familiaritywith hardware… more
    Cisco (12/16/25)
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  • Manufacturing Systems Engineer I

    Fujifilm (Santa Clara, CA)
    …of many applications such as commercial printing, graphics, label & packaging , additive manufacturing, ceramic tiles, textiles, electronics and life science ... research. We're looking for forward-thinkers eager to spark innovation in inkjet technology. Bring your talents to a team built on collaboration, creativity, and a passion for excellence. At FUJIFILM Dimatix, every product we make begins with the extraordinary… more
    Fujifilm (12/16/25)
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  • Manufacturing Systems Engineer II

    Fujifilm (Santa Clara, CA)
    …of many applications such as commercial printing, graphics, label & packaging , additive manufacturing, ceramic tiles, textiles, electronics and life science ... research. We're looking for forward-thinkers eager to spark innovation in inkjet technology. Bring your talents to a team built on collaboration, creativity, and a passion for excellence. At FUJIFILM Dimatix, every product we make begins with the extraordinary… more
    Fujifilm (12/16/25)
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  • Intern 2026: Software Engineer

    IBM (San Jose, CA)
    …towards state-of-the-art chip architecture, design, fabrication and advanced chip packaging . Background knowledge of computer science, data science, machine learning ... or other computational techniques are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions. **Required technical and professional expertise** * Computer Science * Information Technology *… more
    IBM (12/11/25)
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  • Hardware Developer Engineer Intern

    IBM (San Jose, CA)
    …automation * Signal integrity, power integrity, and analysis * Microelectronics packaging * Materials analysis and characterization * Mechanical design, modeling and ... technology integration * Circuit design / electrical design * Thermal design and testing * Voltage regulation and power delivery * Processor, component, and system characterization * Customer and field engineering support * Firmware architecture, development,… more
    IBM (12/10/25)
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  • Senior Staff Thermal Design Engineer

    Celestica (San Jose, CA)
    …operation of heat transfer hardware. + Consider the thermal aspects of chip packaging technologies. + Apply best-in-class fluid flow geometry and technology to cool ... high heat flux chips. + Determine and consider the effects of contact resistance and the use of Thermal Interface Materials. + Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost. +… more
    Celestica (12/06/25)
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  • Senior Deep Learning Frameworks Sustaining…

    NVIDIA (Santa Clara, CA)
    …helpful. + Utilizing tools involved in building software (Make, Docker, Bazel), packaging systems (Debian, pip, npm, etc.), Build Systems (Gitlab, CI/Jenkins). + ... Prior experience with machine learning algorithms and frameworks (TensorFlow, PyTorch, or MXNet). + Ability to work independently, contribute to the stability of releases, and effectively communicate status to those involved in the release in a detail-oriented… more
    NVIDIA (12/03/25)
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