• Senior Principal Mechanical Design Engineer

    RTX Corporation (Tewksbury, MA)
    …support. Mechanical Engineering is searching for an experienced Senior Principal Design Engineer to work in the Radar Design Department. This onsite role will ... shooting skills. + Experience with phase array structures, and/or hardware packaging , and/or array integration for military or mechanical or commercial applications… more
    RTX Corporation (11/06/25)
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  • Senior Mechanical Engineer

    Evolv Technology (Waltham, MA)
    …At Evolv, that's our mission, and we're looking for a hands-on Senior Mechanical Engineer to help us bring it to life. As a design-driven company, we combine ... tolerance stack-up, GD&T, and materials selection + Experience with tight electronics packaging and thermal management + Familiarity with FEA, DFR, and reliability… more
    Evolv Technology (11/04/25)
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  • Senior MLOps Engineer

    EBSCO Information Services (Boston, MA)
    …Join us to help make an impact. **Your Opportunity** As a Senior ML Ops Engineer 1, you will play a key role in designing, building, and maintaining production-grade ... and deployment across AWS environments. + Implement automation for model packaging , testing, deployment, and monitoring using CI/CD best practices. + Collaborate… more
    EBSCO Information Services (10/29/25)
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  • Sr. Principal RF Module Design/Development…

    RTX Corporation (Andover, MA)
    …Experience leading teams and/or projects + Experience in module/sub-system assembly & packaging process + Experience in thermal modeling and analysis. + Experience ... of different topology trade-offs, process and active/passive component selection, system/sub-system level, gain-loss analysis and flowing down requirements from the system to the component level + Hands-on experience with electromagnetic simulation tools such… more
    RTX Corporation (10/16/25)
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  • Senior Signal Delivery Engineer (Compute…

    Teradyne (North Reading, MA)
    …within our existing customer base. We are seeking a Senior Signal Delivery Engineer to join the Teradyne Innovation Lab - the team responsible for developing ... across various operating conditions + Collaborate with cross-functional teams including packaging , PCB layout, and silicon design to optimize signal paths and… more
    Teradyne (10/11/25)
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  • Senior Microwave R&D Engineer (Compute Test…

    Teradyne (North Reading, MA)
    …within our existing customer base. We are seeking a Senior Microwave R&D Engineer to join the Teradyne Innovation Lab - the team responsible for developing ... above 10 GHz + Familiarity with beamforming, phased array antennas, mm-wave packaging , and signal processing for radar and sensing applications + Strong analytical… more
    Teradyne (10/11/25)
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  • Senior Software Engineer (Teradyne, North…

    Teradyne (North Reading, MA)
    …team in North Reading is looking for an experienced Linux Software Engineer III with passion for learning, developing high quality software, solving complex ... (Windows, Linux): management of processes/threads, environment, user accounts, software packaging , remote access with ssh/scp/sftp + Working knowledge of Linux… more
    Teradyne (10/07/25)
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  • DevOps Engineer , Legal Innovation…

    Suffolk University (Boston, MA)
    DevOps Engineer , Legal Innovation and Technology Lab - Clinical Fellow (Remote) Time Limited Boston, Massachusetts Apply Description Th is DevOps role will work ... monitoring tools + Such as prometheus and grafana + Experience in modern python packaging and pip + Experience with Linux ops capabilities, ie systemd , syslog-ng,… more
    Suffolk University (10/07/25)
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  • Process Integration Engineer Co-op…

    Applied Materials (Hudson, MA)
    …Our opportunity will give you hands-on experience in semiconductor and advanced packaging process environments, and help you establish an understanding of the ... relationships between device design, material physics, process development, technology integration and functional characterization. The position will entail the following: + Assist with fabrication of proof-of-concept devices, which may include one or more of… more
    Applied Materials (12/19/25)
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  • Intern 2026: Software Engineer

    IBM (Cambridge, MA)
    …towards state-of-the-art chip architecture, design, fabrication and advanced chip packaging . Background knowledge of computer science, data science, machine learning ... or other computational techniques are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions. **Required technical and professional expertise** * Computer Science * Information Technology *… more
    IBM (12/11/25)
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