• Operations Engineer , Deployment & Ramp,…

    Amazon (Westborough, MA)
    Description In the Mechatronics & Sustainable Packaging Customer Experience organization, we have the unique role and privilege to work backwards from our customer ... easy-to-service. Are you enthusiastic about the latest advancements in Mechatronics Sustainable Packaging (MSP) automation technology? Would you like to play a vital… more
    Amazon (07/03/25)
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  • Ops Engineer , Deployment & Ramp,…

    Amazon (Westborough, MA)
    Description In the Mechatronics & Sustainable Packaging Customer Experience organization, we have the unique role and privilege to work backwards from our customer ... you enthusiastic about the latest advancements in Mechatronics Sustainable Packaging (MSP) automation technology? Would you like to play... Customer Experience Org. In the position of Ops Engineer Deployment & Ramp, you will be tasked with… more
    Amazon (06/11/25)
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  • Systems Engineer III , MSP CX-DR

    Amazon (North Reading, MA)
    Description In the Mechatronics & Sustainable Packaging Customer Experience(MSP CX) organization, we have the unique role and privilege to work backwards from our ... Are you enthusiastic about the latest advancements in Mechatronics & Sustainable Packaging (MSP) automation technology? Would you like to play a vital role… more
    Amazon (06/07/25)
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  • Mechanical Engineer III

    Textron (Wilmington, MA)
    **Mechanical Engineer III ** **Description** **_Who We Are_** Textron Systems is part of Textron, a $14 billion, multi\-industry company employing 35,000 talented ... **_About This Role_** Textron Systems is seeking a Full time Mechanical Engineer with experience in mechanical design focused on military applications\. The… more
    Textron (08/07/25)
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  • Mechanical Engineer III

    Mercury Systems (Andover, MA)
    …Job Summary: Mercury Systems is looking for a hard-working, innovative mechanical engineer , who can learn quickly and bring a fresh perspective to complex ... module assembly design based on open standards. Assignments include mechanical packaging design, printed wiring board layout and ECAD support, connector selection,… more
    Mercury Systems (08/04/25)
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  • Operations Engineer II, MSP CX-DR

    Amazon (North Reading, MA)
    Description In the Mechatronics & Sustainable Packaging Customer Experience organization, we have the unique role and privilege to work backwards from our customer ... you enthusiastic about the latest advancements in Mechatronics Sustainable Packaging (MSP) automation technology? Would you like to play... Customer Experience Org. In the position of Ops Engineer Deployment & Ramp, you will be tasked with… more
    Amazon (06/11/25)
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  • Sr. Operations Engineer , Robotics

    Amazon (Westborough, MA)
    Description As a Sr. Operations Engineer , you will lead and manage the lifecycle of challenging cross-functional projects, developing and delivering the next ... part of your critical tasks. As a Sr. Operations Engineer for Amazon, you will work with some of...program status. About the team The Mechatronics & Sustainable Packaging Customer Experience (MSP CX) team works backwards from… more
    Amazon (07/22/25)
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  • Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging , and testing of electronic and photonic circuits. These ... lab system. * Compound Semiconductor Laboratory (CSL): Facilities housing III -V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic… more
    MIT Lincoln Laboratory (08/08/25)
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  • Integrated Circuit (IC) Layout and Mask Design…

    MIT Lincoln Laboratory (Lexington, MA)
    …fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging , and testing of electronic and photonic circuits. These ... lab system. * Compound Semiconductor Laboratory (CSL): Facilities housing III -V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic… more
    MIT Lincoln Laboratory (05/29/25)
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