• Software Engineering Manager - AI

    Meta (New York, NY)
    …with inference and memory optimization, quantization, and/or sparsity 14. MSc or PhD in machine learning, computer science, electrical engineering, computational ... neuroscience, statistics, or related fields 15. First author publications in AI conferences like ICLR, ICML, NeurIPS, ACL, AAAI, EMNLP, CVPR, MLSys etc 16. Research and production experience in one or more of the following: agentic AI, reinforcement learning,… more
    Meta (07/25/25)
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  • Research Scientist - Magnetic Resonance

    GE HealthCare (Niskayuna, NY)
    …**Required Qualifications** + Ph.D. degree in Physics, Medical Physics, Electrical Engineering, Biomedical Engineering, Chemistry, Computer Engineering, or other ... related fields, with at least 4 years of research experience. + A demonstrated record of research and development as evidenced by peer-reviewed conference proceedings and journal publications. + Strong fundamentals in MR imaging physics, electromagnetic… more
    GE HealthCare (07/07/25)
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  • MTS Device Engineering

    Global Foundries (Malta, NY)
    …root cause of Device, yield and product functionality issues. + Use electrical & inline data analysis, failure analysis, product and design information, and ... technology understanding to identify improvement opportunities. + Collaborate with electrical Test, Integration and Process Modules to implement fast...of experience, or MS degree + 5 years, or PhD + 3 years + Working experience as a… more
    Global Foundries (07/24/25)
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  • Postdoctoral Fellow-Msh-13400-323

    Mount Sinai Health System (New York, NY)
    …various omics and biochemical analyses, to interrogate roles for ion channels, electrical activity and calcium signaling during normal development and in the context ... proliferation, migration and differentiation. https://labs.icahn.mssm.edu/panagiotakoslab **Qualifications** Basic qualifications: + PhD or MD/ PhD in Developmental and Stem… more
    Mount Sinai Health System (08/08/25)
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  • Adjunct Instructor - School of Applied…

    SUNY Delhi (Delhi, NY)
    …and Building (BT) (https://www.delhi.edu/academics/majors-programs/bachelors/construction-management/index.php) Electrical Construction and Instrumentation: IBEW ... Online) Electrical Construction and Instrumentation (AAS, AOS) (https://www.delhi.edu/academics/majors-programs/associates/ electrical -construction-instrumentation/index.php) Electrical Construction and Plumbing (AOS) … more
    SUNY Delhi (07/19/25)
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  • Fellow - SiPh Packaging & Assembly

    Global Foundries (Malta, NY)
    …risk factors, packaging design rules, materials selection criteria, definition of electrical , photonic, and thermal stress plan for chiplet and product module ... data transfer is a requirement. Validated record of photonic and electrical interconnect innovation and product release/partnership with optical/ electrical OSAT… more
    Global Foundries (08/08/25)
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  • Manager SiPh Packaging Architecture, Design,…

    Global Foundries (Malta, NY)
    …customer requirements. The candidate will bring a strong focus on thermal, mechanical, electrical , and optical chip package co- design . Focus on product and ... , packaging design rules, materials selection criteria, definition of electrical , photonic and thermal definition for chiplet and product...and programs Required Qualifications: + MS +7 , or PhD + 5 or more years of experience +… more
    Global Foundries (07/24/25)
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  • Postdoctoral Fellow-MSH

    Mount Sinai Health System (New York, NY)
    …have a Ph.D. in one of the following: Biomedical Engineering, Computer Science, Electrical Engineering, Physics, Mathematics, or a related field, with a focus on MR ... doctoral thesis in one of the following: Biomedical Engineering, Computer Science, Electrical Engineering, Physics, Mathematics, or a related field, with a focus on… more
    Mount Sinai Health System (05/19/25)
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  • MTS Silicon Photonics Product Packaging Materials

    Global Foundries (Malta, NY)
    …factors, meeting packaging design rules, and material selection criteria to meet assembly, electrical , photon ic and thermal requirements fo r chipl et and photonic ... compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions . It is expected that options for… more
    Global Foundries (07/24/25)
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  • Manager of Packaging Assembly Integration

    Global Foundries (Malta, NY)
    …package risk factors, packaging design rules, materials selection criteria, definition of electrical , photonic and thermal stress plan for chiplet and product module ... interconnect and packaging assembly technologies and solutions with present state-of-the-art electrical interconnect solutions . It is expected that options for… more
    Global Foundries (07/24/25)
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