• Staff Semiconductor Process Engineer

    Lockheed Martin (Goleta, CA)
    …and execution of advanced Focal Plane Array \(FPA\) including wicking, plasma system, substrate thinning, dicing, Anti\-Reflection \(AR\) coating, and flip\-chip ... the advancement of FPA technology\. Assignments include the definition of processing and handling equipment requirements and specifications, review of processing… more
    Lockheed Martin (12/11/25)
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