- Micron Technology, Inc. (Boise, ID)
- …across multiple disciplines and organizations including Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration. Qualifications ... world to learn, communicate and advance faster than ever. ** Principal ** **Signal Integrity** **Engineer** **- Interface Pathfinding** Micron's Interface Pathfinding… more
- Micron Technology, Inc. (Boise, ID)
- …packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip -On-Wafer (COW), Flip Chip , Through Silicon Vias (TSV), etc. ... Use advanced EDA techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal simulation applications such as… more
