• Lead Semiconductor Reliability…

    RTX Corporation (Andover, MA)
    …years of prior work experience with device -level reliability testing and characterization in compound semiconductor field, preferably GaN and GaAs + ... defense applications. Your subject matter technical expertise in reliability testing and characterization , device physics, and applied statistics is key to the… more
    RTX Corporation (07/20/25)
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  • Semiconductor Backside Via Process Lead

    RTX Corporation (Andover, MA)
    …with cross-functional teams + Experience with characterizing, understanding, and improving semiconductor device performance and reliability **What We Offer:** ... role will serve as the backside via process lead engineer and collaborate with the various engineering work centers...to effectively transfer ideas + Broad knowledge related to semiconductor processing, device physics, and data analysis… more
    RTX Corporation (06/11/25)
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  • Module Process Engineer III - New College…

    Applied Materials (Hudson, MA)
    …proof-of-concept devices, which may include one or more of the following: device layout, wafer processing, metrology and characterization , physical and ... build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the… more
    Applied Materials (07/10/25)
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  • Integrated Circuit (IC) Layout and Mask Design…

    MIT Lincoln Laboratory (Lexington, MA)
    …to facilitate design, lithographic mask layout, material growth and characterization , fabrication (eg, silicon, compound- semiconductor , wafer bonding, flip-chip ... including development of bulk and epitaxial crystal growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS… more
    MIT Lincoln Laboratory (05/29/25)
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  • Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …to facilitate design, lithographic mask layout, material growth and characterization , fabrication (eg, silicon, compound- semiconductor , wafer bonding, flip-chip ... including development of bulk and epitaxial crystal growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS… more
    MIT Lincoln Laboratory (05/09/25)
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  • PCB Signal and Power Integrity Engineer

    Teradyne (North Reading, MA)
    …Overview Teradyne has an immediate need for a Signal and Power Integrity Hardware Engineer for a full-time position with Semiconductor Test Division personnel to ... powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device more
    Teradyne (06/28/25)
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