• Lead Semiconductor Reliability…

    RTX Corporation (Andover, MA)
    …world. **Job Summary:** An exciting opportunity has opened for a Lead Semiconductor Reliability Engineer to join our Advanced Microelectronic Solutions ... 5 years of prior work experience + Experience with Reliability testing and characterization experience in compound semiconductor field, preferably GaN and GaAs +… more
    RTX Corporation (04/09/25)
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  • Integrated Circuit (IC) Layout and Mask Design…

    MIT Lincoln Laboratory (Lexington, MA)
    …to facilitate design, lithographic mask layout, material growth and characterization , fabrication (eg, silicon, compound- semiconductor , wafer bonding, flip-chip ... including development of bulk and epitaxial crystal growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS… more
    MIT Lincoln Laboratory (03/12/25)
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  • Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …to facilitate design, lithographic mask layout, material growth and characterization , fabrication (eg, silicon, compound- semiconductor , wafer bonding, flip-chip ... including development of bulk and epitaxial crystal growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS… more
    MIT Lincoln Laboratory (05/09/25)
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  • Staff PA Design Engineer

    Skyworks (Andover, MA)
    Staff PA Design Engineer Apply now " Date:May 7, 2025 Location: Andover, MA, US Company: Skyworks If you are looking for a challenging and exciting career in the ... Job Summary Skyworks is seeking a Staff PA Design Engineer for its Mobile Solutions (MSB) Division in Andover,...the complete cycle of product development for high-performance, high-volume semiconductor products and have an eye for details while… more
    Skyworks (04/12/25)
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  • Systems Administrator

    MIT Lincoln Laboratory (Lexington, MA)
    …to facilitate design, lithographic mask layout, material growth and characterization , fabrication (eg, silicon, compound- semiconductor , wafer bonding, flip-chip ... including development of bulk and epitaxial crystal growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS… more
    MIT Lincoln Laboratory (02/25/25)
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