• Sr Principal Semiconductor Electroplating…

    Northrop Grumman (Apopka, FL)
    …and motivated **Senior Principal Microelectronics Semiconductor Electroplating Process Engineer ** for our Advanced Packaging Technology facility in **Apopka, ... meets the most demanding challenges. The **Senior Principal Microelectronic Semiconductor Electroplating Process Engineer ** will provide senior fabrication… more
    Northrop Grumman (08/08/25)
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  • Advanced Lead - SiC/GaN Power Module…

    GE Aerospace (Pompano Beach, FL)
    …we have to offer. A GaN (Gallium Nitride) and SiC (Silicon Carbide) Power Module Packaging Engineer focuses on the design of power modules along with ... high power density power electronics. **Job Description** The Power Module Packaging Engineer is responsible for developing, optimizing, and implementing… more
    GE Aerospace (08/07/25)
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  • Associate, Electrical Engineer (Palm Bay,…

    L3Harris (Palm Bay, FL)
    packaging and MEMS technology + Experience with high density interconnect and semiconductor packaging technology is desired + Determine design approaches and ... cyber domains in the interest of national security. Job Title: Associate, Electrical Engineer Job Code: 28756 Job Location: Palm Bay, FL Job Description: + Determine… more
    L3Harris (09/25/25)
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  • Microelectronic Technician 2

    Northrop Grumman (Apopka, FL)
    …perform a variety of technical, chemical, and photolithography duties with the development , processing, and control of semiconductor material and devices._ ... You'll Get To Do_** _:_ + _Run fabrication equipment for processing semiconductor materials and devices under the guidance of process documentation, which includes… more
    Northrop Grumman (09/16/25)
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