- Eliassen Group (Boise, ID)
- …The Packaging Engineer position will entail all aspects of packaging development from planning, designing, developing advanced/novel packaging , and ... **RF Packaging Engineer ** **Anywhere** **Type:** Contract **Category:**...from IC's, System In Packages, sub-assemblies, and modules. The packaging development process includes package definition, stack-up,… more
- Micron Technology, Inc. (Boise, ID)
- …related technical field + 0-5 years of direct experience working as a process development engineer in an R&D environment + Knowledge of Advanced Package ... the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for starting up, developing ... and advance faster than ever. **Department Intro:** The Technology Development (TD) department at Micron Technology is at the...+ Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor… more
- Micron Technology, Inc. (Boise, ID)
- …5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + Strong knowledge of RDA tooling capability, ... in the industry. As a Principal RDA and Metrology Engineer in APTD, you will be primarily responsible for...directly with Advanced Packaging metrology or RDA development in the semiconductor industry + Data… more
- Micron Technology, Inc. (Boise, ID)
- …and Advanced Packaging functions. **What You'll Do** As a Workforce Development Engineer , you will: + Collaborate with engineering, manufacturing, and ... the world to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID… more
- Micron Technology, Inc. (Boise, ID)
- …physics based Advanced Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The team plays a ... of intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor process technology development , package development , design,… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at ... future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you will be primarily...(SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental… more
- Micron Technology, Inc. (Boise, ID)
- …teams, supporting technology development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be recognized ... Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at ... in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be...experience + 8 years of validated experience in Process Integration/ Development or Package Integration within the semiconductor … more
- Micron Technology, Inc. (Boise, ID)
- …subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of ... products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development . We handle the interconnect and signaling exploration and development… more