- Northrop Grumman (Linthicum Heights, MD)
- …selection and/or custom component requirements flow down and trades + Ceramic and organic printed circuit board materials, design, fabrication, and assembly ... processes + Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip + Product life cycle support from concept through production support + Designing for high reliability, space requirements and environments + AESA / phased array, Radar,… more
- Johns Hopkins University (Baltimore, MD)
- …with the programming and operation of coordinate measuring machines. Classified Title: Sr . Staff Engineer Job Posting Title (Working Title): Instrument Shop ... materials including aluminum, steel, stainless steel, titanium, inconel, copper, brass, bronze, ceramic , and plastic. + Design tooling and fixtures as needed to… more