- Johns Hopkins University (Gaithersburg, MD)
- …will include but are not limited to: - Developing new test methods for thin film interfacial adhesion. - Characterizing the degradation of materials and ... interfaces before, during, and after exposure to accelerated laboratory aging. - Conducting in-situ environmental digital image correlation (DIC) to quantify package and assembly deformation during thermal cycling - Developing FIB/TEM/SEM analytical methods… more
- Northrop Grumman (Linthicum Heights, MD)
- …uniformity. + Chemical Vapor Deposition (CVD): Creating high quality, high performance thin films where a volatile precursor gas reacts with the wafer/substrate ... Using high temperature furnaces to drive species into the substrate or to create thin inter facial layers by introducing a gas or solid source material to modify… more