- Johns Hopkins University (Gaithersburg, MD)
- …through hybrid metrology, open-source, analysis methods, structural maps for wafers with thin films of essential interest to the semiconductor community. Key ... determine structural (physical and chemical) properties of blanket (non-patterned) thin films on Si and SiC wafers....X-ray photoelectron spectroscopy, to determine the structural properties of thin film samples. - Use open-source (python)… more
- Northrop Grumman (Linthicum Heights, MD)
- …of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools + Ability to ... of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools + Ability to work 3rd… more
- Northrop Grumman (Linthicum Heights, MD)
- …of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools. + Basic knowledge ... metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools. + Basic knowledge of… more
- Northrop Grumman (Linthicum Heights, MD)
- …* Experience with TEOS- and silane-based dielectric deposition * Experience with thin film characterization equipment and techniques * Experience with ... * Experience with TEOS- and silane-based dielectric deposition * Experience with thin film characterization equipment and techniques * Experience with… more
- Northrop Grumman (Linthicum Heights, MD)
- …chemistry, developer chemistry, anti-reflective coatings, liftoff processes, image reversal, and thin - film strip and rework procedures. Engineer should also be ... well with others as well as experienced in coat defect resolution, film -thickness optimization, root-cause-analysis, and design of experiments. The Electron Beam and… more
- Northrop Grumman (Linthicum Heights, MD)
- …+ Experience modeling electron-phonon interactions. + Experience with Monte Carlo simulations of thin film growth and ordering. + Degree in physics, materials ... science, electrical engineering, or related STEM field. + Active US Government security clearance. Primary Level Salary Range: $127,400.00 - $191,200.00 Secondary Level Salary Range: $158,600.00 - $238,000.00 The above salary range represents a general… more
- Johns Hopkins University (Gaithersburg, MD)
- …will include but are not limited to: - Developing new test methods for thin film interfacial adhesion. - Characterizing the degradation of materials and ... interfaces before, during, and after exposure to accelerated laboratory aging. - Conducting in-situ environmental digital image correlation (DIC) to quantify package and assembly deformation during thermal cycling - Developing FIB/TEM/SEM analytical methods… more
- Northrop Grumman (Linthicum Heights, MD)
- …be experienced with I-Line and DUV exposure systems, maskless direct-write systems, thin film coating, liftoff processes, image reversal, and resist chemistry. ... Engineer should also be familiar with a wide variety of metrology tools including CDSEM and overlay measurement. The selected candidate should be hands on, have an aptitude for technology development and demonstrate an ability to communicate well with others… more
- Northrop Grumman (Jessup, MD)
- …+ Experience modeling electron-phonon interactions. + Experience with Monte Carlo simulations of thin film growth and ordering. + Active US Government security ... clearance. Primary Level Salary Range: $217,300.00 - $325,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the… more
- Johns Hopkins University (Gaithersburg, MD)
- …optimized for used in PICs based on the silicon-in-insulator, silicon nitride, and thin film lithium niobate platforms. Key responsibilities will include but are ... not limited to: + Perform a literature review to assess existing test structure designs and methodologies for PIC parameter extraction + Set up electromagnetic simulation models of existing test structure geometries to enable simulation and optimization for… more